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APPARATUS AND METHOD OF TESTING A WIRING CIRCUIT

  • US 20200132758A1
  • Filed: 05/30/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/29/2018
  • Status: Active Grant
First Claim
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1. An apparatus for testing a wiring circuit, the apparatus comprising:

  • a circuit substrate having wirings formed in the circuit substrate and pads formed on an upper surface of the circuit substrate and connected to the wirings;

    an electrode located below a lower surface of the circuit substrate;

    an optical sensor located above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and

    an optical unit located above the optical sensor and configured to irradiate light,wherein the optical sensor comprises;

    an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and

    a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate.

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