APPARATUS AND METHOD OF TESTING A WIRING CIRCUIT
First Claim
1. An apparatus for testing a wiring circuit, the apparatus comprising:
- a circuit substrate having wirings formed in the circuit substrate and pads formed on an upper surface of the circuit substrate and connected to the wirings;
an electrode located below a lower surface of the circuit substrate;
an optical sensor located above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and
an optical unit located above the optical sensor and configured to irradiate light,wherein the optical sensor comprises;
an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and
a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus for testing a wiring circuit includes: a circuit substrate having wirings in the circuit substrate and pads on an upper surface of the circuit substrate and connected to the wirings; an electrode below a lower surface of the circuit substrate; an optical sensor above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit above the optical sensor and configured to irradiate light, wherein the optical sensor includes: an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region reflecting light incident on the optical substrate and a second region transmitting the light incident on the optical substrate.
1 Citation
30 Claims
-
1. An apparatus for testing a wiring circuit, the apparatus comprising:
-
a circuit substrate having wirings formed in the circuit substrate and pads formed on an upper surface of the circuit substrate and connected to the wirings; an electrode located below a lower surface of the circuit substrate; an optical sensor located above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit located above the optical sensor and configured to irradiate light, wherein the optical sensor comprises; an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. An apparatus for testing a wiring circuit, the apparatus comprising:
-
an electric signal generator configured to generate an electric signal for generating an electric field; a circuit substrate having an upper surface and a lower surface, the circuit substrate including wirings formed therein; a first electrode located on a first portion of the circuit substrate; a second electrode located on a second portion of the circuit substrate; an optical sensor configured to detect an electric field emitted from an upper surface of the circuit substrate; and an optical unit located on the optical sensor and configured to irradiate light, wherein the optical sensor comprises; an optical substrate whose optical characteristics are changed by the electric field emitted from the upper surface of the circuit substrate; and a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate. - View Dependent Claims (12, 13, 14, 15)
-
-
16-25. -25. (canceled)
-
26. An apparatus for testing a wiring circuit, the apparatus comprising:
-
a circuit substrate having wirings formed in the circuit substrate and pads formed on a first surface of the circuit substrate and connected to the wirings; an electrode spaced apart from a second surface of the circuit substrate and generating a first electric field towards the second surface of the circuit substrate; and an optical sensor spaced apart from the first surface of the circuit substrate and configured to detect a second electric field emitted from the first surface of the circuit substrate, wherein the optical sensor comprises; an optical substrate; and a reflective layer disposed on the optical substrate and facing the circuit substrate, the reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate. - View Dependent Claims (27, 28, 29, 30)
-
Specification