DATA ANALYZER, SEMICONDUCTOR MANUFACTURING SYSTEM, DATA ANALYSIS METHOD, AND SEMICONDUCTOR MANUFACTURING METHOD

• US 20200133249A1
• Filed: 12/30/2019
• Published: 04/30/2020
• Est. Priority Date: 08/29/2017
• Status: Active Grant

• Current Assignee: Gigaphoton, Inc. (Komatsu Ltd.)
• Original Assignee: Gigaphoton, Inc. (Komatsu Ltd.)
• Inventors: IGARASHI, Yutaka, MINEGISHI, Yuji, WAKABAYASHI, Osamu
• Granted Patent: US 11,353,857 B2
• Time in Patent Office: Days
• CPC Class Codes: G03F 7/20 Exposure; Apparatus therefor photographic printing apparatus for making copies G03B27/00
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/31308 Capture image asynchronously with processing of analysis, identification
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 21/027 Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 photographic masks or originals per se G03F1/00; registration or positioning of photographic masks or originals G03F9/00; photographic cameras G03B; control of position G05D3/00
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A data analyzer includes a data collector that acquires data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus that exposes a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus that inspects the exposed wafer, an image generator that visualizes the data on each of the parameters collected by the data collector from the apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generates a plurality of mapped images for each of the parameters of the apparatuses, and a correlation computing section that performs pattern matching on arbitrary ones of the mapped images generated from the wafer to determine a correlation value between arbitrary ones of the parameters of the apparatuses.

Claims

1. A data analyzer comprising:

a data collector configured to acquire data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus;

an image generator configured to visualize the data on each of the plurality of parameters collected by the data collector from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generate a plurality of mapped images for each of the parameters of the plurality of apparatuses; and

a correlation computing section configured to perform pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses.

2. The data analyzer according to claim 1,

wherein the correlation computing section outputs at least information on a set of parameters from which a largest correlation value has been derived.

3. The data analyzer according to claim 2,

wherein the correlation computing section outputs information on a plurality of sets of parameters in a descending order of the correlation value.

4. The data analyzer according to claim 2,

further comprising a display configured to display information on the parameters outputted from the correlation computing section.

5. The data analyzer according to claim 4,

wherein the display displays the correlation value between the parameters and the mapped images.

6. The data analyzer according to claim 1,

further comprising a filtering section configured to perform digital image filtering on the mapped images generated by the image generator.

7. The data analyzer according to claim 1,

wherein the exposure apparatus performs scanning exposure, and

the predetermined area is an area where the exposure apparatus performs a single action of the scanning exposure.

8. The data analyzer according to claim 1,

further comprising a controller configured to change a parameter relating to control of at least one apparatus out of the plurality of apparatuses based on the correlation value between the parameters.

9. The data analyzer according to claim 8,

wherein the controller changes a parameter relating to control of the at least one apparatus based on a result of inspection of the wafer performed by the wafer inspection apparatus.

10. The data analyzer according to claim 1,

wherein the correlation computing section determines a correlation value between parameters of different apparatuses out of the plurality of apparatuses.

11. The data analyzer according to claim 1,

wherein the correlation computing section determines a correlation value between parameters in a single apparatus out of the plurality of apparatuses.

12. The data analyzer according to claim 1,

wherein the image generator is configured to generate a mapped image in which differences in data are expressed in grayscales.

13. The data analyzer according to claim 12,

wherein the image generator sets a target value of each of the parameters to be a median of the grayscales.

14. The data analyzer according to claim 1,

wherein the light source apparatus is a laser apparatus.

15. The data analyzer according to claim 14,

wherein the data that the data collector acquires from the laser apparatus includes

data on a beam characteristic of the pulsed light,

data on pulse energy of the pulsed light, and

data on a spectrum of the pulsed light.

16. The data analyzer according to claim 1,

wherein the data that the data collector acquires from the exposure apparatus includes

data on an exposure condition.

17. The data analyzer according to claim 1,

wherein the data that the data collector acquires from the wafer inspection apparatus includes

data on a shape of the wafer, and

data on a defect of the wafer.

18. A semiconductor manufacturing system comprising:

a plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus;

a data collector configured to acquire data on each analysis target parameter of each of the plurality of apparatuses from the apparatus;

an image generator configured to visualize the data on each of the plurality of parameters collected by the data collector from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generate a plurality of mapped images for each of the parameters of the plurality of apparatuses;

a correlation computing section configured to perform pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses; and

a controller configured to change a parameter relating to control of at least one apparatus out of the plurality of apparatuses based on the correlation value between the parameters.

19. A data analysis method comprising:

acquiring data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus;

visualizing the data on each of the plurality of parameters acquired from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generating a plurality of mapped images for each of the parameters of the plurality of apparatuses; and

performing pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses.

20. A semiconductor manufacturing method comprising:

acquiring data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus;

visualizing the data on each of the plurality of parameters acquired from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generating a plurality of mapped images for each of the parameters of the plurality of apparatuses;

performing pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses; and

changing a parameter relating to control of at least one apparatus out of the plurality of apparatuses based on the correlation value between the parameters.