ELECTRONIC DEVICE MODULE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS

• US 20200133347A1
• Filed: 12/31/2019
• Published: 04/30/2020
• Est. Priority Date: 04/05/2018
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: HONG, Suk Youn, RYU, Jong In, HONG, Seung Hyun, KIM, Jang Hyun
• Granted Patent: US 11,209,872 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: G06F 1/1698 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone details of antennas disposed inside a computer H01Q1/2266
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/023 using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09972 : Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2203/025 : Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/288 : Removal of non-metallic coatings, e.g. for repairing

Abstract

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Claims

1. An electronic device module comprising:

a substrate;

a sealing portion disposed on a first surface of the substrate;

a first component disposed outside of the sealing portion on the first surface of the substrate;

a second component disposed on the first surface of the substrate and embedded in the sealing portion; and

a shielding wall at least partially disposed between the first component and the second component,

wherein the shielding wall and the first component are configured to have an empty space therebetween.

2. The electronic device module of claim 1, wherein the sealing portion is disposed between the shielding wall and the second component.

3. The electronic device module of claim 1, wherein the shielding wall is a square ring, and the first component is disposed in an internal space defined by the shielding wall.

4. The electronic device module of claim 1, wherein the shielding wall comprises two walls connected to each other, and at least one of the two walls is disposed between the first component and the second component.

5. The electronic device module of claim 1, wherein the shielding wall extends across an entire width of the first surface of the substrate.

6. The electronic device module of claim 1, wherein the substrate comprises a ground electrode, and the shielding wall is bonded to the ground electrode.

7. The electronic device module of claim 1, further comprising:

a shielding layer disposed along a surface of the sealing portion.

8. The electronic device module of claim 7, wherein the shielding layer is connected to an upper end of the shielding wall.

9. The electronic device module of claim 7, wherein the shielding layer and the shielding wall are formed of different materials.

10. The electronic device module of claim 7, wherein the sealing portion comprises a first sealing portion without the shielding layer and connected to the shielding wall, a second sealing portion provided with the shielding layer, and a third sealing portion without the shielding layer and having a thickness, with respect to the first surface of the substrate, that is less than a thickness of the first sealing portion and a thickness of the second sealing portion, and

further comprising an antenna disposed on or in a portion of the substrate that overlaps the third sealing portion.

11. An apparatus comprising:

an electronic device module comprising

a substrate,

a sealing portion disposed on the first surface of the substrate,

a first component disposed on the first surface of the substrate,

a second component disposed on the first surface of the substrate and embedded in the sealing portion,

a shielding structure at least partially disposed between the first component and the second component, and

an antenna disposed on a second surface of the substrate opposite the first surface or inside the substrate at a position that overlaps the first component,

wherein the shielding structure and the first component are configured to have an empty space therebetween.

12. The apparatus of claim 11, wherein the shielding structure comprises a first wall disposed between the first component and the second component.

13. The apparatus of claim 12, wherein the first wall has a height above the first surface of the substrate that is shorter than a height of the sealing portion.

14. The apparatus of claim 12, wherein the shielding structure comprises a second wall, the first wall has a height above the first surface of the substrate that is equal to a height of the sealing portion, and the second wall has a height above the first surface of the substrate that is shorter than the height of the sealing portion.