Modular PC Cooling Pump

• US 20200133356A1
• Filed: 10/25/2019
• Published: 04/30/2020
• Est. Priority Date: 10/29/2018
• Status: Active Grant

• Current Assignee: Corsair Memory Incorporated (Corsair Gaming, Inc.)
• Original Assignee: Corsair Memory Incorporated (Corsair Gaming, Inc.)
• Inventors: Paul, Andy, Labedz, Janusz, Andres, Guillermo, Depay, Dean, Clerkin, Eamonn, Lampard, George Joseph
• Granted Patent: US 11,409,342 B2
• Time in Patent Office: Days
• CPC Class Codes: F21V 33/0092 with heating or cooling devices
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H05K 7/20172 Fan mounting or fan specifications
• CPC Class Codes: H05K 7/20209 Thermal management, e.g. fan control
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A modular PC cooling pump for use in a personal computer is disclosed, according to certain embodiments. The modular PC cooling pump comprises a plurality of stackable interchangeable modules, according to certain embodiments.

Claims

1. A modular PC cooling pump comprising:

a plurality of stackable modules, the plurality of stackable modules including;

one or more cover modules, one or more functional modules, and one or more pump modules;

wherein the one or more cover modules, the one or more functional modules and the one or more pump modules are interchangeable with other modules.

2. The modular PC cooling pump of claim 1, wherein the one or more cover modules is any one or more of:

an OLED type display cover module, an LED type cover module, an engraved type cover module, a painted type cover module, an etched type cover module, a light diffuser type cover module, and a lens type cover module.

3. The modular PC cooling pump of claim 1, wherein the one or more functional modules is any one or more of:

a temperature sensor module, a light source module, a sound level sensor module, a pressure sensor module, a humidity sensor module, an air flow sensor module, an audio microphone sensor module, a light sensor module, a piezo device module, a accelerometer module, a particle sensor module, a gas sensor module, a pump circuitry module, a fan speed module, a camera module, and a wireless transceiver module.

4. The modular PC cooling pump of claim 1, wherein the one or more pump modules is any one or more of:

an impeller with motor type module, a cold plate type module.

5. The modular PC cooling pump of claim 1, wherein the one or more cover modules is symmetrical.

6. The modular PC cooling pump of claim 1, wherein the one or more cover modules is asymmetrical.

7. The modular PC cooling pump of claim 1, wherein two or more pump modules are stacked to satisfy a predetermined flow requirement of liquid flowing through the stacked pump modules.

8. The modular PC cooling pump of claim 1, wherein two or more cover modules are stacked to form part of the modular PC cooling pump.

9. The modular PC cooling pump of claim 1, wherein two or more functional modules are stacked to form part of the modular PC cooling pump.