DEVICE HAVING TIME DIVISION MULTIPLEXING CAPABILITY OF HEAT DISSIPATION

• US 20200133357A1
• Filed: 12/27/2019
• Published: 04/30/2020
• Est. Priority Date: 01/18/2018
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Zhai, Haifang, Wu, Hendry Xiaoping, Dong, David, Zhou, Yujie
• Granted Patent: US 10,948,956 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H05K 5/026 having standardized interfaces flash memory cards G06K19/077
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.

Claims

1. A device comprising:

a housing comprising a first side and a second side;

one or more temperature sensors; and

a rotatable heat sink arranged to modify a direction of an air flow flowing through the rotatable heat sink from the first side of the housing out the second side of the housing based at least in part on one or more temperature measurements made by the one or more temperature sensors.

2. The device of claim 1 further comprising:

a first component arranged in a first air flow path from the first side of the housing out a first portion of the second side of the housing; and

a second component arranged in a second air flow path from the first side of the housing out a second portion of the second side of the housing;

wherein the rotatable heat sink is arranged to modify the direction of the air flow between the first air flow path and the second air flow path.

3. The device of claim 2 wherein the first component comprises a first set of thermal performance requirements and the second component comprises a second set of thermal performance requirements different than the first set of thermal performance requirements, and wherein the rotatable heat sink is arranged to modify the direction of the air flow flowing through the rotatable heat sink based at least in part on the first set of thermal performance requirements and the second set of thermal performance requirements.

4. The device of claim 2 wherein the one or more temperature sensors are configured to measure a temperature of at least one of the first component and the second component.

5. The device of claim 2 wherein the rotatable heat sink is mounted to a third component.

6. The device of claim 5 wherein the one or more temperature sensors are configured to measure a temperature of the third component.

7. The device of claim 6 wherein the device is an input/output (I/O) card, the first component is an M.2 card, the second component is a battery, and the third component is a central processing unit (CPU).

8. The device of claim 1 wherein the one or more temperature sensors are configured to measure a temperature of the air flow flowing through the rotatable heat sink.

9. The device of claim 1 wherein the rotatable heat sink comprises a rotatable set of cooling fins configured to control the direction of the air flow flowing through the rotatable heat sink by rotating orientations of the cooling fins.

10. The device of claim 9 wherein the rotatable heat sink comprises a fixed baseplate and a rotatable baseplate, between which a coil spring is arranged, the coil spring being operable to drive the rotatable baseplate to rotate the orientations of the cooling fins.

11. The device of claim 10 further comprising a heat-generating component, wherein the rotatable heat sink is arranged on the heat-generating component and the fixed baseplate contacts the heat-generating component so as to dissipate heat for the heat-generating component.

12. The device of claim 9 wherein the rotatable heat sink comprises a coil spring configured to drive the cooling fins to rotate in response to an air pressure of the air flow flowing through the rotatable heat sink to modify the direction of the air flow flowing through the rotatable heat sink.

13. An electronic apparatus comprising the device of claim 1.

14. An electrical apparatus comprising the device of claim 1.

15. A method comprising:

obtaining one or more temperature measurements utilizing one or more temperature sensors of a device, the device comprising a housing and a rotatable heat sink;

modifying a direction of an air flow flowing through the rotatable heat sink from a first side of the housing out a second side of the housing based at least in part on the one or more temperature measurements.

16. The method of claim 15 wherein the device comprises a first component arranged in a first air flow path from the first side of the housing out a first portion of the second side of the housing and a second component arranged in a second air flow path from the first side of the housing out a second portion of the second side of the housing, and wherein modifying the direction of the air flow flowing through the rotatable heat sink comprises modifying the direction of the air flow between the first air flow path and the second air flow path.

17. The method of claim 16 wherein the first component comprises a first set of thermal performance requirements and the second component comprises a second set of thermal performance requirements different than the first set of thermal performance requirements, and wherein modifying the direction of the air flow flowing through the rotatable heat sink is based at least in part on the first set of thermal performance requirements and the second set of thermal performance requirements.

18. The method of claim 15 wherein the rotatable heat sink comprises a rotatable set of cooling fins configured to control a direction of the air flow flowing through the rotatable heat sink by rotating orientations of the cooling fins.

19. The method of claim 18 wherein the rotatable heat sink comprises a coil spring configured to drive the cooling fins to rotate in response to an air pressure of the air flow flowing through the rotatable heat sink to modify the direction of the air flow flowing through the rotatable heat sink.

20. The method of claim 19 wherein modifying the direction of the air flow flowing through the rotatable heat sink comprises adjusting the air pressure of the air flow flowing through the rotatable heat sink.