Flexible Sensor

• US 20200133418A1
• Filed: 09/29/2017
• Published: 04/30/2020
• Est. Priority Date: 10/01/2016
• Status: Active Grant

• Current Assignee: Peratech Holdco Limited.
• Original Assignee: Peratech Holdco Limited.
• Inventors: GOSPEL, Matthew
• Granted Patent: US 10,990,235 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 2203/04102 Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/04146 using pressure sensitive conductive elements delivering a boolean signal and located between crossing sensing lines, e.g. located between X and Y sensing line layers
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

A flexible sensor (201) comprises a first conductive layer (202) and a second conductive layer (203). The first conductive layer and the second conductive layer define a sensing region (205) for determining an interaction, such as a mechanical interaction. The first conductive layer comprises a first substrate (206) having a plurality of conductive rows (207) printed thereon and the second conductive layer comprises a second substrate 208 having a plurality of columns (209) printed thereon. The first conductive layer and the second conductive layer are constrained by a constraining means (505) which holds the two layers together but permits movement of the layers perpendicular to each other in the sensing region.

Claims

1. A flexible sensor, comprising:

a first conductive layer; and

a second conductive layer;

said first conductive layer and said second conductive layer define a sensing region for determining a mechanical interaction;

wherein

said first conductive layer comprises a first substrate having a plurality of conductive rows printed thereon;

said second conductive layer comprises a second substrate having a plurality of conductive columns printed thereon; and

said first conductive layer and said second conductive layer are constrained by a constraining means so as to maintain said first conductive layer and said second conductive layer together while permitting movement of said first conductive layer and said second conductive layer perpendicular to each other in said sensing region.

2. The flexible sensor of claim 1, wherein said first conductive layer and said second conductive layer are constrained by said constraining means in a first direction and a second direction parallel to said first conductive layer and said second conductive layer respectively.

3. The flexible sensor of claim 1, wherein at least one of said first substrate and said second substrate comprises a substance that exhibits a variable resistivity and said variable resistivity is dependent upon pressure applied to said second conductive layer.

4. The flexible sensor of claim 3, wherein said substance is a quantum tunnelling composite.

5. The flexible sensor of claim 1, wherein each said conductive row comprises at least one of silver-loaded ink or carbon loaded ink.

6. The flexible sensor of claim 1, wherein each said conductive column comprises at least one of silver-loaded ink or carbon loaded ink.

7. The flexible sensor of claim 1, wherein said constraining means comprises a plurality of slots on one of said first conductive layer and said second conductive layer, and a plurality of corresponding pins on the other of said first conductive layer and said second conductive layer.

8. The flexible sensor of claim 1, wherein said first conductive layer and said second conductive layer are suspended in a free floating configuration within an enclosure.

9. The flexible sensor of claim 8, wherein said enclosure is attached to an electronic device.

10. The flexible sensor of claim 9, wherein said electronic device is a display.

11. The flexible sensor of claim 9, wherein said electronic device is substantially curved.

12. A method of manufacturing a flexible sensor, comprising the steps of:

providing a first conductive layer and a second conductive layer, said first conductive layer and said second conductive layer defining a sensing region for determining a mechanical interaction, said first conductive layer comprising a first substrate and said second conductive layer comprising a second substrate;

printing a plurality of conductive rows on said first substrate;

printing a plurality of conductive columns on said second substrate; and

constraining said first conductive layer and said second conductive layer by a constraining means such that said first conductive layer and said second conductive layer are maintained together while being permitted to move perpendicular to each other in said sensing region.

13. The method of claim 12, further comprising the step of:

suspending said first conductive layer and said second conductive layer in a free floating configuration within an enclosure.

14. The method of claim 13, further comprising the step of:

attaching said enclosure to an electronic device.

15. The method of claim 12, wherein said step of positioning includes the steps of:

constraining said first conductive layer and said second conductive layer by said constraining means in a first direction and a second direction parallel to said first conductive layer and said second conductive layer respectively.

16. The method of claim 12, further comprising the step of:

printing a substance that exhibits a variable resistivity onto said first substrate.

17. The method of claim 16, wherein said substance is a quantum tunnelling ink.