Method for Fabricating a Smart Card Device

• US 20200134413A1
• Filed: 12/27/2019
• Published: 04/30/2020
• Est. Priority Date: 12/04/2015
• Status: Active Grant

• Current Assignee: Eng Seng Ng, Smartflex Technology Pte., Ltd. (NovoFlex Pte Ltd.)
• Original Assignee: Smartflex Technology Pte., Ltd. (NovoFlex Pte Ltd.)
• Inventors: Ng, Eng Seng, Pang, Sze Yong
• Granted Patent: US 10,685,275 B2
• Time in Patent Office: Days
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence

Abstract

Embodiments of the invention relate to processes for fabricating a smart device, e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers interposing a flexible film having conductor pattern thereon, at least one flip chip for operating the smart card device is embedded in a first substrate such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip is arranged at a position in a first vertical plane; and a contact pad, for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane. The contact pad is projected through a cavity in a second substrate to form a continuous even plane from an outer surface of the laminated substrate layers to the contact pad.

Claims

1. :

A method for fabricating a smart card device, the method comprising;

providing a carrier core in which a flexible film having a plurality of conductor patterns is interposed between a first substrate and a second substrate, characterised in that each of the conductor patterns includes;

at least one flip chip,

at least one contact pad arranged at an offset relative to the at least one flip chip,

at least one conductor path electrically coupling the at least one contact pad to the at least one flip chip, wherein the at least one conductor path and the at least one contact pad are formed on the flexible film,

wherein the step of providing a carrier core in which a flexible film having a plurality of conductor patterns is interposed between a first substrate and a second substrate further includes;

exposing the at least one contact pad through at least one cavity in the second substrate; and

laminating the carrier core to produce a laminated carrier core in which the at least one contact pad is projected through the at least one cavity in the second substrate to form a continuous even plane from an outer surface of the laminated carrier core to the at least one contact pad such that a region between the contact pad and the outer surface of the laminated carrier core is devoid of gap.

2. :

The method of claim 1, wherein providing a carrier core in which a flexible film having a plurality of conductor patterns is interposed between a first substrate and a second substrate further includes;

overlaying the flexible film on the first substrate to produce a temporary core;

laminating the temporary core to produce a laminated temporary core; and

overlaying a second substrate on the laminated temporary core to produce the carrier core.

3. :

The method of claim 1, wherein providing a carrier core in which a flexible film having a plurality of conductor patterns is interposed between a first substrate and a second substrate further includes;

abutting the at least one flip chip to the first substrate, wherein the at least one flip chip and the at least one contact pad are arranged on opposite sides of the flexible film,

wherein laminating the carrier core to produce a laminated carrier core further includes;

embedding the at least one flip chip into the first substrate.

4. :

The method of claim 3, wherein the first substrate is devoid of cavity.

5. :

The method of claim 3, wherein the first substrate is provided with at least one cavity having at least one dimensional measurement no greater than at least one dimensional measurement of the at least one flip chip, and wherein the at least one cavity of the first substrate is dimensioned to at least partially receive the at least one flip chip therein.

6. :

The method of claim 5, wherein the at least one dimensional measurement is selected from the group consisting of height, length and width.

7. :

The method of claim 1, wherein providing a carrier core in which a flexible film having a plurality of conductor patterns is interposed between a first substrate and a second substrate further includes;

abutting the at least one flip chip to the second substrate, wherein the at least one flip chip and the at least one contact pad are arranged on same side of the flexible film,

wherein laminating the carrier core to produce a laminated carrier core further includes;

embedding the at least one flip chip into the second substrate.

8. :

The method of claim 1, wherein laminating the carrier core to produce a laminated carrier core further includes;

subjecting the carrier core to a hot cycle, wherein subjecting the carrier core to a hot cycle includes subjecting the carrier core to high temperature of at least 80°

C. and applying pressure of at least 20×

10⁵ pascal (Pa) to the carrier core; and

subjecting the carrier core to a cold cycle, wherein subjecting the carrier core to a cold cycle includes subjecting the carrier core to low temperature of no more than 30°

C. and applying pressure of at least 20×

10⁵ pascal (Pa) to the carrier core.

9. :

The method of claim 1, further comprising;

cutting the laminated carrier core into a plurality of individual sections.

10. :

The method of claim 9, wherein cutting the laminated carrier core into a plurality of individual sections further includes;

cutting each of the individual sections, wherein each of the individual sections includes at most one of the at least one conductor pattern and is dimensioned as 85.60 mm×

53.98 mm.

11. :

The method of claim 10, wherein the at least one contact pad is dimensioned to include at least a first contact location, a second contact location, a third contact location, a fifth contact location, a sixth contact location, a seventh location wherein

the first contact location is within 19.23 mm to 20.93 mm from an upper edge of the laminated carrier core and within 10.25 mm and 12.25 mm from a left edge of the laminated carrier core, which is adjacent to the upper edge,

the second contact location is within 21.77 mm to 23.47 mm from the upper edge and within 10.25 mm to 12.25 mm from the left edge,

the third contact location is within 24.31 mm to 26.01 mm from the upper edge and within 10.25 mm to 12.25 mm from the left edge,

the fifth contact location is within 19.23 mm to 20.93 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge,

the sixth contact location is within 21.77 mm to 23.47 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge,

the seventh contact location is within 24.31 mm to 26.01 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge,

and wherein the contact pad is dimensioned to optionally include

a fourth contact location within 26.85 mm to 28.55 mm from the upper edge and within 10.25 mm to 12.25 mm from the left edge,

an eighth contact location within 26.85 mm to 28.55 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge.

12. :

The method of claim 11, wherein an embossing area is designated on each of the individual sections and has a width of 85.47 to 85.90 mm and a height of 24.03 mm.

13. :

The method of claim 1, wherein a thickness of the first substrate is greater than a thickness of the second substrate.

14. :

The method of claim 1, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

15. The method of claim 2, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

16. :

The method of claim 3, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

17. :

The method of claim 4, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

18. :

The method of claim 5, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

19. :

The method of claim 6, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

20. :

The method of claim 7, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

21. :

The method of claim 8, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

22. :

The method of claim 9, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

23. :

The method of claim 10, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

24. :

The method of claim 11, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

25. :

The method of claim 12, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.

26. :

The method of claim 13, wherein each of the conductor patterns further includes at least one antenna coil formed on the flexible film, and wherein the at least one antenna coil is electrically coupled to the at least one flip chip.