SYSTEM AND METHOD FOR ENCODING IC CHIPS FOR PAYMENT OBJECTS

• US 20200134582A1
• Filed: 10/10/2019
• Published: 04/30/2020
• Est. Priority Date: 02/24/2016
• Status: Active Grant

• Current Assignee: CPI Card Group - Colorado Incorporated (CPI Card Group), CPI Card Group - Minnesota Incorporated (CPI Card Group), CPI Card Group - Tennessee, Inc.
• Original Assignee: CPI Card Group - Colorado Incorporated (CPI Card Group)
• Inventors: MOSTELLER, BARRY
• Granted Patent: US 10,949,820 B2
• Time in Patent Office: Days
• CPC Class Codes: B42D 25/485 by electronic processing means
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06Q 20/105 involving programming of a portable memory device, e.g. IC cards, "electronic purses"
• CPC Class Codes: G06Q 20/341 Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
• CPC Class Codes: G06Q 20/355 Personalisation of cards for use
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support

Abstract

A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

Claims

1-22. -22. (canceled)

23. A system for providing integrated circuit (IC) chip modules for use in payment objects, comprising:

at least a first rotatable member for engaging a first side edge portion of a flexible tape to which a plurality of IC chip modules are supportably interconnected, wherein each of the plurality of IC chip modules comprise an IC chip and interconnected antenna that are fixedly interconnected to a flexible carrier defined by different portions of said flexible tape;

at least one controller to provide position control signals for automated rotation of the first rotatable member and automated positioning of each of the plurality of IC chip modules at one or more of a plurality of predetermined positions along a travel path, free from fixed interconnection of the plurality of IC modules and interconnected flexible substrate to any card body or other support structure;

at least one of a contact IC chip interface device and non-contact IC chip interface device for encoding data in predetermined memory portions each said IC chip comprising the plurality of IC modules at said one of the plurality of predetermined positions, including personalization data provided by an issuer payment institution corresponding with a specific payment account administered by the issuer payment institution and issuer key data provided by the issuer payment institution, wherein said at least one controller provides encoding control signals to said at least one of a contact IC chip interface device and non-contact IC chip interface device for said data encoding.

24. A system as recited in claim 23, further comprising:

at least a first punch for separating acceptable ones of said plurality of IC chip modules from the flexible tape at another one of said plurality of predetermined positions in response to control signals provided by said at least one controller.

25. A system as recited in claim 24, further comprising:

at least a first receptacle support for supporting a receptacle, wherein for a given order of IC chip modules a plurality of said separated, acceptable ones of said plurality of IC chip modules are receivable in a common receptacle supported by the first receptacle support.

26. A system as recited in claim 24, further comprising:

a second punch for separating unacceptable ones of said plurality of IC chip modules from the flexible tape at an additional one of said plurality of predetermined positions in response to control signals provided by said at least one controller.

27. A system as recited in claim 24, wherein said at least one of an contact IC chip interface device and non-contact IC chip interface device is further provided for testing IC chips of the plurality of IC chip modules, pursuant to control signals provided by the at least one controller, to identify unacceptable ones and said acceptable ones of said plurality of IC chip modules.

28. A system as recited in claim 23, wherein said at least one of a contact IC chip interface device and non-contact IC chip interface device comprises:

a radio frequency signal transceiver for non-contact interface with antennas of the plurality of IC chip modules for data transmission; and

,

radio frequency shielding members disposed adjacent to upstream and downstream sides of the non-contact IC chip interface device to shield adjacent ones comprising the plurality of IC chip modules during said data encoding.

29. A system as recited in claim 23, further comprising:

one or more position sensor for providing position signals indicative of the presence of a given IC chip module of said plurality of IC chip modules within a corresponding position sensing field, wherein said at least one controller utilizes said position signals in providing said position control signals.

30. A system as recited in claim 29, wherein said at least one position sensor comprises:

a first position sensor positioned upstream of said at least one contact IC chip interface device and non-contact IC chip interface device.

31. A system as recited in claim 30, wherein said at least one position or more position sensor further comprises:

a second position sensor located downstream of the first rotatable member.

32. A system as recited in claim 23, wherein said first rotatable member comprises:

a plurality of outwardly projecting teeth that extend about the first rotatable member for rotated positioning in to and out of apertures extending along at least said first side edge portion of said flexible tape.

33. A system as recited in claim 23, wherein said plurality of IC chip modules are dual interface type chip modules that include an IC chip, an antenna and contact pads interconnected thereto, wherein said first rotatable member comprises:

two sets of outwardly projecting teeth that extend about the first rotatable member for rotated positioning in to and out of apertures extending along said first side edge portion and a second side edge portion of said flexible tape.

34. A system as recited in claim 23, further comprising:

a second rotatable member, wherein said first and second rotatable members are disposed for engaging opposing sides of at least said first side edge portion of the flexible tape.

35. A system as recited in claim 23, wherein flexible substrate and supportably interconnected plurality of IC chip modules are provided on a first reel, and wherein said system further comprises:

a first rotatable reel support for supporting said first reel upstream of said plurality of predetermined positions; and

,

a rotatable second reel support for supporting a second reel downstream of said plurality of predetermined positions, wherein said flexible tape and may be progressively unwound from the first reel and rewound on the second reel.

36. A system as recited in claim 23, wherein said second reel is provided for automated driven rotation, in response to control signals provided by said at least one controller, to position said plurality of IC chip modules at one or more of said plurality of predetermined positions, downstream of said first rotatable member.

37. A system as recited in claim 23, wherein said at least one of an contact IC chip interface device and non-contact IC chip interface device is further provided for powering, reading data from, and testing data stored in predetermined memory portions of the memory of the IC chips of the plurality of IC chip modules pursuant to control signals provided by the at least one controller.

38. A system as recited in claim 23, wherein for each of said plurality of IC chip modules the at least one controller stores corresponding order identification data, unique account identification data and unique chip identification data.

39. A system as recited in claim 23, wherein said system includes a contact IC chip interface device and a non-contact IC chip interface device for encoding data, and wherein said encoding control signals are provided to a predetermined one of said contact IC chip interface device and said non-contact IC chip interface device for encoding data in relation to a given order for IC chip modules utilizing corresponding stored order data.

40. A system as recited in claim 23, further comprising:

an encoding region for completing said data encoding with said flexible tape positioned in a track defined by a base member and an opposing positioning member.