CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

• US 20200135376A1
• Filed: 12/30/2019
• Published: 04/30/2020
• Est. Priority Date: 10/14/2014
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: JEONG, Dong Jin
• Granted Patent: US 11,469,030 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/06 with core substantially closed in itself, e.g. toroid
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

Claims

1. A chip electronic component comprising:

a substrate;

a first internal coil part disposed on one surface of the substrate;

a second internal coil part disposed on the other surface of the substrate opposing one surface thereof;

a via penetrating through the substrate to connect the first and second internal coil parts to each other;

first and second via pads disposed on one surface and another surface of the substrate, respectively, to cover the via; and

a magnetic body enclosing the first and second internal coil parts

wherein a portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side, and

a distance from a portion of the first or second via pad disposed in the recess to the respect second side is smaller than a width of the respective first or second internal coil part.

2. The chip electronic component of claim 1, wherein the portion of the first or second internal coil part is insulated from the first or second via pad.

3. The chip electronic component of claim 2, wherein a center of the recess and a center of the first or second via pad coincide with each other.

4. The chip electronic component of claim 1, wherein the first via pad is formed by extending one end portion of the first internal coil part, and

the second via pad is formed by extending one end portion of the second internal coil part.

5. The chip electronic component of claim 1, wherein the first and second internal coil parts and the first and second via pads are formed by plating.

6. The chip electronic component of claim 1, wherein the first or second via pad and the portion of the first or second internal coil part have an interval of 3pm or more therebetween.