ENTANGLED INDUCTOR STRUCTURES

• US 20200135388A1
• Filed: 06/28/2019
• Published: 04/30/2020
• Est. Priority Date: 10/31/2018
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: CHANG, Ka Fai, LIU, Chin-Chou, CHANG, Fong-Yuan, LEE, Hui Yu, CHENG, Yi-Kan
• Granted Patent: US 10,943,729 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/28 Coils; Windings; Conductive connections
• CPC Class Codes: H01F 27/34 Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
• CPC Class Codes: H01F 41/04 for manufacturing coils coils for transformer or inductances H01F27/28
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5283 Cross-sectional geometry
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 28/10 Inductors

Abstract

An entangled inductor structure generates opposite polarity internal magnetic fields therein to substantially reduce, or cancel, external magnetic fields propagating outside of the entangled inductor structure. These reduced external magnetic fields propagating outside of the entangled inductor structure effectively reduce a keep out zone (KOZ) between the entangled inductor structure and other electrical, mechanical, and/or electro-mechanical components. This allows the entangled inductor structure to be situated closer to these other electrical, mechanical, and/or electro-mechanical components within the IC as compared to conventional inductors which generate larger external magnetic fields.

Claims

1. An entangled current carrying structure of an entangled inductor structure, the entangled current carrying structure comprising:

a first entangled current carrying node from among a plurality of entangled current carrying nodes;

a second entangled current carrying node from among the plurality of entangled current carrying nodes;

a third entangled current carrying node from among the plurality of entangled current carrying nodes; and

a fourth entangled current carrying node from among the plurality of entangled current carrying nodes

wherein the first entangled current carrying node through the fourth entangled current carrying node are electrically interconnected to one another to form a first continuous electrical conductor for carrying an electrical current,

wherein adjacent external magnetic fields from among a plurality of external magnetic fields generated by adjacent entangled current carrying nodes from among the plurality of entangled current carrying nodes in response to carrying the current are opposite in polarity to each other.

2. The entangled current carrying structure of claim 1, wherein the plurality of entangled current carrying nodes is implemented on a plurality of semiconductor substrates, and

wherein a plurality of through silicon via (TSV) structures within the plurality of semiconductor substrate interconnect the plurality of entangled current carrying nodes.

3. The entangled current carrying structure of claim 1, wherein the plurality of entangled current carrying nodes are implemented as a plurality of open geometric structures.

4. The entangled current carrying structure of claim 3, wherein the plurality of open geometric structures comprise:

a plurality of open rectangular geometric structures.

5. The entangled current carrying structure of claim 1, wherein the first entangled current carrying node is electrically interconnected to the second entangled current carrying node,

wherein the second entangled current carrying node is electrically interconnected to the third entangled current carrying node,

wherein the third entangled current carrying node is electrically interconnected to the fourth entangled current carrying node,

wherein the fourth entangled current carrying node is electrically interconnected to the first entangled current carrying node.

6. The entangled current carrying structure of claim 1, wherein adjacent internal magnetic fields from among a plurality of internal magnetic fields generated by the adjacent entangled current carrying nodes in response to carrying the current are similar in polarity to each other.

7. The entangled current carrying structure of claim 1, wherein the entangled current carrying structure is mechanically and electrically connected to a second entangled current carrying structure to form the entangled inductor structure.

8. The entangled current carrying structure of claim 1, wherein the adjacent external magnetic fields are opposite in polarity to each other.

9. A method for forming an entangled inductor structure, the method comprising:

forming a first entangled current carrying structure from among a plurality of entangled current carrying structures onto a first semiconductor substrate from among a plurality of semiconductor substrates, the first entangled current carrying structure including a first plurality of entangled current carrying nodes,

wherein a first entangled current carrying node from among the first plurality of entangled current carrying nodes is situated adjacent to a second entangled current carrying node from among the first plurality of entangled current carrying nodes,

wherein the second entangled current carrying node is situated adjacent to a third entangled current carrying node from among the first plurality of entangled current carrying nodes,

wherein the third entangled current carrying node is situated adjacent to a fourth entangled current carrying node from among the first plurality of entangled current carrying nodes,

wherein the fourth entangled current carrying node is situated adjacent to the first entangled current carrying node,

wherein the first entangled current carrying node is electrically connected to the second entangled current carrying node and the third entangled current carrying node, and

wherein the second entangled current carrying node is electrically connected to the third entangled current carrying node and the fourth entangled current carrying node; and

forming a second entangled current carrying structure from among the plurality of entangled current carrying structures onto a second semiconductor substrate from among the plurality of semiconductor substrates, the second entangled current carrying structure including a second plurality of entangled current carrying nodes; and

connecting the first entangled current carrying structure to the second entangled current carrying structure to form the entangled inductor structure.

10. The method of claim 9, wherein the connecting comprises:

bonding a through silicon via (TSV) structure within the first semiconductor substrate to the second entangled current carrying structure to form the entangled inductor structure.

11. The method of claim 9, wherein the first plurality of entangled current carrying nodes and the second plurality of entangled current carrying nodes are implemented as a first plurality of open geometric rectangular geometric structures and a second plurality of open geometric rectangular geometric structures, respectively.

12. The method of claim 9, wherein the forming the first entangled current carrying structure comprises:

forming the first entangled current carrying structure along a first plane,

wherein the forming the second entangled current carrying structure comprises;

forming the second entangled current carrying structure along a second plane, the first plane being parallel to the second plane.

13. An entangled inductor structure, comprising:

a first semiconductor substrate having a first entangled current carrying structure from among a plurality of entangled current carrying structures, the first entangled current carrying structure including a first plurality of entangled current carrying nodes; and

a second semiconductor substrate having a second entangled current carrying structure from among the plurality of entangled current carrying structures situated onto a second semiconductor substrate from among the plurality of semiconductor substrates, the second entangled current carrying structure including a second plurality of entangled current carrying nodes,

wherein the first plurality of entangled current carrying nodes are electrically interconnected to one another to form a first continuous electrical conductor for carrying an electrical current, and

wherein the second plurality of entangled current carrying nodes are electrically interconnected to one another to form a second continuous electrical conductor for carrying the electrical current.

14. The entangled inductor structure of claim 13, wherein the first entangled current carrying structure and the second entangled current carrying structure are situated within a first plane and a second plane, respectively, the first plane being parallel to the second plane.

15. The entangled inductor structure of claim 13, wherein first adjacent external magnetic fields from among a first plurality of external magnetic fields generated by first adjacent entangled current carrying nodes from among the first plurality of entangled current carrying nodes in response to carrying the current are opposite in polarity to each other, and

wherein second adjacent external magnetic fields from among a second plurality of external magnetic fields generated by second adjacent entangled current carrying nodes from among the second plurality of entangled current carrying nodes in response to carrying the current are opposite in polarity to each other .

16. The entangled inductor structure of claim 15, wherein the first plurality of entangled current carrying nodes and the second plurality of entangled current carrying nodes are implemented as a first plurality of open geometric rectangular geometric structures and a second plurality of open geometric rectangular geometric structures, respectively.

17. The entangled inductor structure of claim 13, wherein a first entangled current carrying node from among the first plurality of entangled current carrying nodes is electrically interconnected to a second entangled current carrying node from among the first plurality of entangled current carrying nodes,

wherein the second entangled current carrying node is electrically interconnected to a third entangled current carrying node from among the first plurality of entangled current carrying nodes,

wherein the third entangled current carrying node is electrically interconnected to a fourth entangled current carrying node from among the first plurality of entangled current carrying nodes, and

wherein the fourth entangled current carrying node is electrically interconnected to the first entangled current carrying node.

18. The entangled inductor structure of claim 13, wherein first adjacent internal magnetic fields from among a first plurality of internal magnetic fields generated by the first adjacent entangled current carrying nodes in response to carrying the electrical current are similar in polarity to each other, and

wherein second adjacent internal magnetic fields from among a second plurality of internal magnetic fields generated by the second adjacent entangled current carrying nodes in response to carrying the current are similar in polarity to each other.

19. The entangled inductor structure of claim 13, wherein the first semiconductor substrate includes a through silicon via (TSV) structure to mechanically and electrically connect the first entangled current carrying structure and the second entangled current carrying structure.

20. The entangled inductor structure of claim 13, wherein the first adjacent external magnetic fields are opposite in polarity to each other, and

wherein the second adjacent external magnetic fields are opposite in polarity to each other.