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DEVICE FOR PROVIDING GAS TO A PLASMA CHAMBER AND A PLASMA PROCESSING DEVICE INCLUDING THE SAME

  • US 20200135433A1
  • Filed: 05/09/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/31/2018
  • Status: Active Grant
First Claim
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1. A plasma processing device, comprising:

  • a chamber including a space that is configured to perform a treatment process for a wafer;

    a supporting member disposed inside of the chamber and configured to support the wafer; and

    a gas supply unit configured to inject a mixed gas in different directions toward the supporting member, wherein the pressure of the mixed gas is controlled by adding inert gas to reactive gas.

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