STAGE DEVICE AND PROCESSING APPARATUS

• US 20200135434A1
• Filed: 10/22/2019
• Published: 04/30/2020
• Est. Priority Date: 10/25/2018
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: NAKAGAWASAI, Manabu, SUZUKI, Naoyuki, ORIMOTO, Shinji, YOKOHARA, Hiroyuki, YAMAGATA, Motoi, MAEDA, Koji
• Granted Patent: US 11,417,504 B2
• Time in Patent Office: Days
• CPC Class Codes: C23C 14/34 Sputtering
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/505 for rotation of the substrates
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: H01F 1/447 characterised by magnetoviscosity, e.g. magnetorheological, magnetothixotropic, magnetodilatant liquids electrorheological fluids C10M171/001
• CPC Class Codes: H01F 10/3254 the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
• CPC Class Codes: H01F 41/32 for applying conductive, insulating or magnetic material on a magnetic film , specially adapted for a thin magnetic film
• CPC Class Codes: H01J 2237/002 Cooling arrangements of objects being observed or treated H01J2237/2001
• CPC Class Codes: H01J 2237/20214 Rotation
• CPC Class Codes: H01J 2237/332 Coating
• CPC Class Codes: H01J 37/32715 Workpiece holder
• CPC Class Codes: H01J 37/32724 Temperature
• CPC Class Codes: H01J 37/3426 Material
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/67393 characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
• CPC Class Codes: H01L 21/683 for supporting or gripping for conveying H01L21/677, for positioning, orientation or alignment H01L21/68
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: H01L 21/68792 characterised by the construction of the shaft
• CPC Class Codes: H10N 50/01 : Manufacture or treatment

Abstract

A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.

Claims

1. A stage device comprising:

a stage configured to hold a target substrate in a vacuum chamber;

a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body;

cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage;

a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure; and

a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.

2. The stage device of claim 1, wherein the stage support includes a main body, and

the main body has a double-walled pipe structure including an inner pipe and an outer pipe, and an inner space between the inner pipe and the outer pipe is maintained in a vacuum state.

3. The stage device of claim 2, wherein the stage support is disposed in a vacuum space communicating with the vacuum chamber,

the outer pipe has a plurality of through-holes, and

the inner space communicates with the vacuum space through the through-holes and becomes the vacuum space.

4. The stage device of claim 2, wherein the main body of the stage support has a diameter-reduced section, and a horizontal part of the diameter-reduced section is formed as a solid plate.

5. The stage device of claim 2, wherein the main body of the stage support has a diameter-reduced section, and the entire main body has the double-walled pipe structure.

6. The stage device of claim 2, wherein the outer pipe has a bent portion having one or more bendings.

7. The stage device of claim 2, wherein the main body of the stage support further includes a radiant heat shield disposed at an outer side of the outer pipe.

8. The stage device of claim 1, wherein the stage support is disposed in a vacuum space communicating with the vacuum chamber, and

a main body of the stage support includes an inner pipe, flanges respectively disposed at an upper end and a lower end of the inner pipe, and a plurality of shafts disposed at an outer side of the inner pipe to connect the flanges.

9. The stage device of claim 8, wherein the stage support further includes a radiant heat shield disposed at the outer side of the inner pipe.

10. The stage device of claim 1, wherein the stage includes an electrostatic chuck configured to electrostatically attract and hold the target substrate.

11. The stage device of claim 10, wherein the cooling fluid supplied to the gap is a first cooling gas, and the first cooling gas is supplied to the gap through a first cooling gas channel formed in the cold heat transfer body.

12. The stage device of claim 11, wherein a second cooling gas for heat transfer is supplied to a gap between the target substrate and the electrostatic chuck through a second cooling gas channel different from the first cooling gas channel.

13. The stage device of claim 11, wherein the first cooling gas is supplied to a gap between the target substrate and the electrostatic chuck through a gas channel communicating with the first cooling gas channel.

14. The stage device of claim 11, further comprising:

a first heat insulating body formed in a cylindrical shape to surround at least a cold head of the chiller and a connection portion between the cold head and the cold heat transfer body and having a vacuum insulation structure.

15. The stage device of claim 14, further comprising:

a second heat insulating body formed in a cylindrical shape to surround the cold heat transfer body and having a vacuum insulation structure.

16. The stage device of claim 15, wherein a space is formed between the stage support and the second heat insulating body and the first cooling gas leaked from the gap flows into the space, the space being sealed with a sealing member, and

a gas channel is connected to the space to discharge the first cooling gas in the space or supply a second cooling gas as counterflow to the first cooling gas into the space.

17. The stage device of claim 1, wherein a connection portion between the stage and the cold heat transfer body has a comb-teeth shaped portion such that the gap between the stage and the cold heat transfer body has a concave-convex pattern.

18. A processing apparatus comprising:

a vacuum chamber;

a stage device and configured to rotatably support a target substrate in the vacuum chamber, the stage device comprising;

a stage configured to hold a target substrate in the vacuum chamber,

a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body,

cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage,

a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and

a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid; and

a processing mechanism configured to process the target substrate in the vacuum chamber.

19. The processing apparatus of claim 18, wherein the processing mechanism includes a target for sputtering film formation, the target being disposed above the stage in the vacuum chamber.

20. The processing apparatus of claim 19, wherein the target is made of a material forming a magnetic film used for a tunneling magneto-resistance element.