Multi Integrated Circuit Chip Carrier Package
First Claim
1. An electronic device fabrication method comprising:
- positioning a multiple IC chip carrier against a carrier deck that comprises a plurality of first alignment features;
aligning a lid, comprising a plurality of second alignment features, with the carrier deck by engaging the first alignment features with the second alignment features;
connecting the lid to each IC chip of the multiple IC chip carrier; and
removing the multiple IC chip carrier from the carrier deck.
1 Assignment
0 Petitions
Accused Products
Abstract
A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.
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Citations
20 Claims
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1. An electronic device fabrication method comprising:
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positioning a multiple IC chip carrier against a carrier deck that comprises a plurality of first alignment features; aligning a lid, comprising a plurality of second alignment features, with the carrier deck by engaging the first alignment features with the second alignment features; connecting the lid to each IC chip of the multiple IC chip carrier; and removing the multiple IC chip carrier from the carrier deck. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A multiple integrated circuit (IC) chip carrier package fabrication system comprising:
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a carrier deck comprising a plurality of first alignment features; a multiple IC chip carrier positioned against the carrier deck, the multiple IC chip carrier comprising multiple IC chips; and a lid comprising a plurality of second alignment features, wherein the plurality of first alignment features engage with the plurality of second alignment features. - View Dependent Claims (12, 13, 14, 15)
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16. A multiple IC chip carrier package fabrication method comprising:
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positioning a convex multiple IC chip carrier against a carrier deck that comprises a plurality of first alignment features; aligning a lid, comprising a plurality of second alignment features, with the carrier deck by engaging the plurality of first alignment features with the plurality of second alignment features; and compressing the convex multiple IC chip carrier and the lid by applying a compressive force between the carrier deck and a fixture cover that is connected to the lid upper surface. - View Dependent Claims (17, 18, 19, 20)
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Specification