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CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

  • US 20200135498A1
  • Filed: 05/29/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/24/2018
  • Status: Active Grant
First Claim
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1. A carrier substrate, comprising:

  • a first layer;

    a second layer; and

    a first glue layer between the first layer and the second layer,wherein the first glue layer is removably attached to the first layer.

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