SEMICONDUCTOR WAFER STORAGE DEVICE

• US 20200135500A1
• Filed: 06/28/2019
• Published: 04/30/2020
• Est. Priority Date: 10/29/2018
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: CHEN, Yu Ju-, JHENG, Ren-Hao
• Granted Patent: US 10,978,326 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/6732 Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
• CPC Class Codes: H01L 21/67366 characterised by materials, roughness, coatings or the like materials relating to an injection moulding process B29C45/00; chemical composition of materials C08L51/00
• CPC Class Codes: H01L 21/67383 characterised by substrate supports
• CPC Class Codes: H01L 21/67386 characterised by the construction of the closed carrier
• CPC Class Codes: H01L 21/67389 characterised by atmosphere control
• CPC Class Codes: H01L 21/67393 characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring

Abstract

The present disclosure describes a device and a method for substrate storage. The device can include a first and a second groups of panels configured to form an enclosed volume, and fin structures disposed at inner surfaces of the second group of panels. Each of the fin structures can be configured to hold a substrate. Each fin structure can include a protrusion extending inwardly into the enclosed volume and a binding device disposed over the protrusion. The binding device can be configured to bind the substrate over the protrusion.

Claims

1. A storage device, comprising:

a first and a second plurality of panels configured to form an enclosed volume; and

a plurality of fin structures disposed at inner surfaces of the second plurality of panels, each of the plurality of fin structures configured to hold a substrate and comprising;

a protrusion extending inwardly into the enclosed volume; and

a binding device disposed over the protrusion, wherein the binding device is configured to bind the substrate over the protrusion.

2. The storage device of claim 1, further comprising a control system configured to move the binding device, to activate a gas extraction system to provide a vacuum to the binding device, or a combination thereof.

3. The storage device of claim 1, further comprising an other plurality of fin structures disposed at the inner surfaces of the second plurality of the panels, wherein each of the other plurality of fin structures comprises a protrusion extending inwardly into the enclosed volume.

4. The storage device of claim 1, wherein the binding device comprises a gas pipe configured to provide a vacuum to bind the substrate to the protrusion.

5. The storage device of claim 1, wherein the binding device comprises a padding layer attached to the protrusion.

6. The storage device of claim 5, wherein the binding device comprises one or more openings configured to provide a vacuum to bind the substrate to the protrusion.

7. The storage device of claim 1, wherein the binding device comprises a clip disposed over the protrusion.

8. The storage device of claim 1, further comprising a gas extraction system connected to each of the binding devices.

9. The storage device of claim 1, wherein the first plurality of panels comprises inlet ports, outlet ports, and a purge system connected to the inlet and outlet ports.

10. A storage device, comprising:

a panel; and

a fin structure configured to hold a wafer and disposed on a side surface of the panel, the fin structure comprising;

a protrusion extending outwardly from the side surface of the panel; and

a padding layer attached to the fin structure, wherein the padding layer comprises one or more openings configured to provide a vacuum to bind the wafer over the protrusion.

11. The storage device of claim 10, further comprising a clip configured to clamp the wafer to the protrusion.

12. The storage device of claim 10, wherein the padding layer is attached to the protrusion via an adhesive, a tape, or a mechanical part.

13. The storage device of claim 10, wherein the padding layer comprises a membrane, a plastic sheet, a tape, or a polymer film.

14. The storage device of claim 10, further comprising a gas pipe interconnected to the one or more openings.

15. A method for substrate storage, comprising:

providing one or more substrates at a first location;

placing the one or more substrates into a storage device, wherein the storage device comprises a plurality of fin structures; and

binding the one or more substrates to the storage device via binding devices associated with each of the plurality of fin structures.

16. The method of claim 15, further comprising:

locating a second location on a stored map of a fabrication facility; and

transporting the storage device to the second location.

17. The method of claim 15, further comprising un-binding the substrates from the storage device.

18. The method of claim 15, wherein placing the one or more substrates into the storage device comprises depositing the one or more substrates into respective one or more slots of the storage device, wherein each of the one or more slots is between two adjacent fin structures of the plurality of fin structures.

19. The method of claim 15, wherein binding the one or more substrates to the storage device comprises applying a vacuum via padding layers associated with each of the plurality of fin structures.

20. The method of claim 15, wherein binding the one or more substrates to the storage device comprises providing a pressure retention via clips associated with each of the plurality of fin structures.