SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
First Claim
1. A semiconductor manufacturing apparatus comprising:
- a chuck stage configured to hold a semiconductor wafer using an end portion of the chuck stage;
a scrubber nozzle configured to discharge a scrubbing fluid to a processing surface of the semiconductor wafer;
a scrubber nozzle scan mechanism configured to cause the scrubber nozzle to perform a scan on the processing surface of the semiconductor wafer;
a stage rotation mechanism configured to rotate the chuck stage; and
a holding stage including a holding fluid nozzle and a top plate, the holding fluid nozzle being configured to discharge a holding fluid to an opposite surface of the semiconductor wafer opposed to the processing surface, the top plate having one main surface facing the opposite surface of the semiconductor wafer, and the holding fluid nozzle being disposed adjacent to a center rather than a periphery portion of the top plate,whereinthe holding fluid discharged from the holding fluid nozzle is caused to flow through an area between the opposite surface of the semiconductor wafer and the one main surface of the top plate to produce holding force over the area, andthe holding force causes the opposite surface to hold pressure applied by the scrubbing fluid discharged from the scrubber nozzle to the processing surface of the semiconductor wafer.
1 Assignment
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Accused Products
Abstract
A semiconductor manufacturing apparatus includes a chuck stage, a scrubber nozzle, a scrubber nozzle scan mechanism, a stage rotation mechanism, and a holding stage including a holding fluid nozzle and a top plate, the top plate having one main surface facing an opposite surface of a wafer, and the holding fluid nozzle being disposed adjacent to a center rather than a periphery portion of the top plate. A holding fluid discharged from the holding fluid nozzle is caused to flow through an area between the opposite surface of the wafer and the one main surface of the top plate to produce holding force, and the holding force causes the opposite surface to hold pressure applied to a processing surface of the wafer by a scrubbing fluid discharged from the scrubber nozzle.
1 Citation
12 Claims
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1. A semiconductor manufacturing apparatus comprising:
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a chuck stage configured to hold a semiconductor wafer using an end portion of the chuck stage; a scrubber nozzle configured to discharge a scrubbing fluid to a processing surface of the semiconductor wafer; a scrubber nozzle scan mechanism configured to cause the scrubber nozzle to perform a scan on the processing surface of the semiconductor wafer; a stage rotation mechanism configured to rotate the chuck stage; and a holding stage including a holding fluid nozzle and a top plate, the holding fluid nozzle being configured to discharge a holding fluid to an opposite surface of the semiconductor wafer opposed to the processing surface, the top plate having one main surface facing the opposite surface of the semiconductor wafer, and the holding fluid nozzle being disposed adjacent to a center rather than a periphery portion of the top plate, wherein the holding fluid discharged from the holding fluid nozzle is caused to flow through an area between the opposite surface of the semiconductor wafer and the one main surface of the top plate to produce holding force over the area, and the holding force causes the opposite surface to hold pressure applied by the scrubbing fluid discharged from the scrubber nozzle to the processing surface of the semiconductor wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification