SUBSTRATE PROCESSING APPARATUS
First Claim
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1. A substrate processing apparatus, comprising:
- a nozzle head that faces a surface to be processed of a substrate and has a recess with its opening toward the surface to be processed;
a treatment liquid supply nozzle provided to the nozzle head and configured to supply a treatment liquid to the surface to be processed;
a gas discharge nozzle provided to the nozzle head and configured to discharge a gas to the surface to be processed;
a removing part configured to remove liquid droplets present in the recess;
a drain part located at a bottom of the recess of the nozzle head, and configured to discharge the liquid droplets as a target to be removed out of the recess, whereinthe removing part is a nozzle that is formed to protrude from a surface of the nozzle head, and configured to discharge a gas to the surface to be processed, andthe nozzle includes a hole that allows the gas to be discharged toward the recess in a direction perpendicular to discharge direction of the gas.
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Abstract
A substrate processing apparatus includes: a removing part configured to remove liquid droplets present in a recess; a drain hole located at the bottom of the recess of a nozzle head, and configured to discharge the liquid droplets as a target to be removed out of the recess; and a controller configured to control the discharge state of a gas discharge nozzle such that there is a period in which a gas is discharged from the gas discharge nozzle at a flow rate, at which the gas discharged does not reach a surface to be processed of the substrate, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.
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Citations
13 Claims
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1. A substrate processing apparatus, comprising:
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a nozzle head that faces a surface to be processed of a substrate and has a recess with its opening toward the surface to be processed; a treatment liquid supply nozzle provided to the nozzle head and configured to supply a treatment liquid to the surface to be processed; a gas discharge nozzle provided to the nozzle head and configured to discharge a gas to the surface to be processed; a removing part configured to remove liquid droplets present in the recess; a drain part located at a bottom of the recess of the nozzle head, and configured to discharge the liquid droplets as a target to be removed out of the recess, wherein the removing part is a nozzle that is formed to protrude from a surface of the nozzle head, and configured to discharge a gas to the surface to be processed, and the nozzle includes a hole that allows the gas to be discharged toward the recess in a direction perpendicular to discharge direction of the gas. - View Dependent Claims (3, 4, 5, 6, 7, 8)
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2. A substrate processing apparatus, comprising:
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a nozzle head that faces a surface to be processed of a substrate and has a recess with its opening toward the surface to be processed; a treatment liquid supply nozzle provided to the nozzle head and configured to supply a treatment liquid to the surface to be processed; a gas discharge nozzle provided to the nozzle head and configured to discharge a gas to the surface to be processed; a removing part configured to remove liquid droplets present in the recess; a drain part located at a bottom of the recess of the nozzle head, and configured to discharge the liquid droplets as a target to be removed out of the recess, wherein the removing part includes a discharge port that is located in a surface of the recess, and configured to discharge a removing material toward the drain part located at the bottom to remove the liquid droplets present in the recess. - View Dependent Claims (9, 10, 11, 12, 13)
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Specification