Integrated Circuit Fabrication System with Adjustable Gas Injector and Method Utilizing the Same

• US 20200135510A1
• Filed: 12/26/2019
• Published: 04/30/2020
• Est. Priority Date: 09/29/2017
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hsu, Yung-Shun, Chang, Ching-Yu, Chang, Chiao-Kai, Cheah, Wai Hong, Lin, Chien-Fang
• Granted Patent: US 11,043,388 B2
• Time in Patent Office: Days
• CPC Class Codes: H01J 2237/20214 Rotation
• CPC Class Codes: H01J 2237/334 Etching
• CPC Class Codes: H01J 37/32 Gas-filled discharge tubes heating by discharge H05B
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32733 Means for moving the material to be treated
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber

Abstract

The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.

Claims

1. A method for semiconductor fabrication:

providing a semiconductor apparatus that further includes

a processing chamber;

a substrate stage configured in the processing chamber and being operable to secure and rotate a semiconductor wafer;

a gas injector attached to the processing chamber and designed to inject a chemical to the processing chamber;

a window attached to the gas injector and in direct contacting with the O-ring;

an O-ring interposed between the gas injector and the window, wherein the O-ring directly contacts the gas injector and the window; and

an adjustable fastening device integrated with the gas injector and designed to secure the window and the gas injector cover to the gas injector with an adjustable height, wherein the adjustable fastening device includes a base plate configured on the gas injector cover; and

a plurality of fasteners to fasten the gas injector cover to the gas injector, wherein each of the fasteners includes a bolt, a first nut and a second nut both sleeved on the bolt, wherein the first nut is configured above the base plate and the second nut is configured between the base plate and the gas injector cover; and

adjusting the adjustable fastening device to secure the window to the gas injector with an adjustable height.

2. The method of claim 1, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes

adjusting the first nut to adjust a distance between the gas injector and the gas injector cover;

and

adjusting the second nut to hold together the gas injector and the gas injector cover.

3. The method of claim 2, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes repeating steps of the adjusting of the first nut to adjust a distance between the gas injector and the gas injector cover, and the adjusting of the second nut to hold together the gas injector and the gas injector cover to other of the fasteners until the gas injector cover is fastened to the gas injector such that the O-ring and the transparent window are evenly contacted with improved sealing effect, thereby eliminating leaking through the interface between that the O-ring and the transparent window.

4. The method of claim 3, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes disposing the base plate on the gas injector cover.

5. The method of claim 4, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes configuring the fasteners with the base plate and the gas injector cover by sleeving the first nut and the second nut on the corresponding bolt such that the first nut is configured on one side of the base plate and the second nut is configured on an opposite side of the base plate.

6. The method of claim 5, wherein the first nut is configured between a bolt head of the bolt and the base plate and the second nut is configured between the base plate and the gas injector cover.

7. The method of claim 1, further comprising performing an etching process to the semiconductor wafer by the semiconductor apparatus.

8. The method of claim 7, wherein the performing of the etching process further includes

injecting the chemical to the processing chamber by the gas injector;

generating plasma to the chemical; and

directing the chemical to the semiconductor wafer for etching.

9. A method for semiconductor fabrication:

providing a semiconductor apparatus that further includes

a processing chamber;

a substrate stage configured in the processing chamber and being operable to secure and rotate a semiconductor wafer;

a gas injector attached to the processing chamber and designed to inject a chemical to the processing chamber;

a window attached to the gas injector and in direct contacting with the O-ring;

an O-ring interposed between the gas injector and the window, wherein the O-ring directly contacts the gas injector and the window; and

an adjustable fastening device integrated with the gas injector and designed to secure the window and the gas injector cover to the gas injector with an adjustable height; and

adjusting the adjustable fastening device to secure the window to the gas injector with an adjustable height.

10. The method of claim 9, further comprising

disposing the O-ring on a circular groove of the gas injector;

and

capping the O-ring by the window.

11. The method of claim 10, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes disposing the base plate on the gas injector cover.

12. The method of claim 11, wherein

the adjustable fastening device includes a base plate configured on the gas injector cover;

and a plurality of fasteners to fasten the gas injector cover to the gas injector; and

each of the fasteners includes a bolt, a first nut and a second nut.

13. The method of claim 12, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes

sleeving the first nut on the bolt such that the first nut is on an upper side of the base plate;

and

sleeving the second nut on the bolt such that the second nut is on a lower side of the base plate.

14. The method of claim 13, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes

adjusting the first nut to adjust a distance between the gas injector and the gas injector cover;

and

adjusting the second nut to hold together the gas injector and the gas injector cover.

15. The method of claim 14, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes repeating steps of the adjusting of the first nut to adjust a distance between the gas injector and the gas injector cover, and the adjusting of the second nut to hold together the gas injector and the gas injector cover to other of the fasteners until the gas injector cover is fastened to the gas injector such that the O-ring and the transparent window are evenly contacted with improved sealing effect.

16. The method of claim 9, further comprising performing an etching process to the semiconductor wafer by the semiconductor apparatus, wherein the performing of the etching process includes

injecting the chemical to the processing chamber by the gas injector;

generating plasma to the chemical; and

directing the chemical to the semiconductor wafer for etching.

17. A method for semiconductor fabrication:

providing a semiconductor apparatus that further includes

a processing chamber;

a substrate stage configured in the processing chamber and being operable to secure and rotate a semiconductor wafer;

a gas injector attached to the processing chamber and designed to inject a chemical to the processing chamber;

a window attached to the gas injector and in direct contacting with the O-ring;

an O-ring that is interposed between the gas injector and the window and directly contacts the gas injector and the window; and

an adjustable fastening device integrated with the gas injector and designed to secure the window and the gas injector cover to the gas injector with an adjustable height, wherein the adjustable fastening device includes a base plate configured on the gas injector cover; and

a plurality of fasteners to fasten the gas injector cover to the gas injector, wherein each of the fasteners includes a bolt, a first nut and a second nut both sleeved on the bolt, wherein the first nut is configured on one side of the base plate and the second nut is configured on an opposite side of the base plate; and

adjusting the first nut to adjust a distance between the gas injector and the gas injector cover; and

adjusting the second nut to hold together the gas injector and the gas injector cover, thereby securing the window to the gas injector with an adjustable height.

18. The method of claim 17, wherein the adjusting of the adjustable fastening device to secure the window to the gas injector further includes adjusting other of the fasteners until the gas injector cover is fastened to the gas injector such that the O-ring and the transparent window are evenly contacted with improved sealing effect.

19. The method of claim 17, wherein the first nut is configured between a bolt head of the bolt and the base plate and the second nut is configured between the base plate and the gas injector cover.

20. The method of claim 17, further comprising performing an etching process to the semiconductor wafer by the semiconductor apparatus, wherein the performing of the etching process further includes

injecting the chemical to the processing chamber by the gas injector;

generating plasma to the chemical; and

directing the chemical to the semiconductor wafer for etching.