TECHNIQUES FOR COMBINING CMP PROCESS TRACKING DATA WITH 3D PRINTED CMP CONSUMABLES

• US 20200135517A1
• Filed: 12/31/2019
• Published: 04/30/2020
• Est. Priority Date: 11/06/2015
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: FUNG, Jason G., BAJAJ, Rajeev, REDFIELD, Daniel, KHANNA, Aniruddh Jagdish, CORNEJO, Mario, MENK, Gregory E., WATKINS, JOHN
• Granted Patent: US 11,986,922 B2
• Time in Patent Office: Days
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24B 49/003 involving acoustic means
• CPC Class Codes: B24B 49/10 involving electrical means B24B49/02, B24B49/08 take precedence
• CPC Class Codes: B24B 49/14 taking regard of the temperature during grinding
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B29C 64/106 using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• CPC Class Codes: B29K 2995/0003 having particular electrical or magnetic properties, e.g. piezoelectric
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/736 Grinding or polishing equipment
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
• CPC Class Codes: H01L 21/67075 for wet etching
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Claims

1. A method of manufacturing a polishing pad, comprising:

depositing a 3D printed first portion of a polishing pad by distributing one or more first polymeric materials from a first nozzle of a 3D print head, wherein the one or more first polymeric materials are electrically non-conductive;

depositing a 3D printed RFID tag by distributing one or more second polymeric materials from a second nozzle of a 3D print head on the 3D printed first portion of the polishing pad, wherein the one or more second polymeric materials include at least one electrically conductive or semi-conductive polymeric material; and

depositing a 3D printed second portion of the polishing pad over the 3D printed RFID tag and the 3D printed first portion by distributing the one or more first polymeric materials from the first nozzle of the 3D print head.

2. The method of claim 1, wherein the one or more second polymeric materials are selected from the group consisting of poly(fluorene), poly(phenylene), poly(pyrene), poly(azulene), poly(naphthalene), poly(acetylene), poly(p-phenylene vinylene), poly(pyrrole), poly(carbazole), poly(indole), poly(azepine), poly(aniline), poly(thiophene), poly (3,4-ethylenedioxythiphene), poly(p-phenylene sulfide), and combinations thereof.

3. The method of claim 1, wherein the 3D printed RFID tag is encapsulated with the 3D printed first portion and the 3D printed second portion.

4. The method of claim 1, further comprising:

3D printing a sensor coupled to the 3D printed RFID tag, wherein a region of the polishing pad disposed between the sensor and a polishing surface of the polishing pad is manufactured from materials having properties configured to improve the accuracy of processing parameter sensing.

5. The method of claim 4, wherein the region of the polishing pad is manufactured from a material having an elastic modulus greater than a remainder of the polishing pad.

6. The method of claim 4, wherein the region of the polishing pad is manufactured from a material having a coefficient of thermal conductivity greater than a remainder of the polishing pad.

7. The method of claim 4, wherein the region of the polishing pad is manufactured from a material having a coefficient of electrical conductivity greater than a remainder of the polishing pad.

8. A method of manufacturing a polishing pad, comprising:

forming a plurality of polishing features of a polymeric body by distributing a first material, wherein the plurality of polishing features are arranged in concentric rings and define a polishing surface configured to contact a substrate;

forming one or more base features of the polymeric body by distributing a second material that is different from the first material; and

disposing a radio frequency identification (RFID) tag within the polymeric body and at a distance from the polishing surface, wherein

the one or more base features are each disposed at a distance from the plurality of polishing features,

the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface, and

the RFID tag stores a plurality of information associated with two or more properties of the polymeric body.

9. The method of claim 8, wherein the first and second materials are selected from the group consisting of epoxies, phenolics, amines, polyesters, urethanes, silicon, acrylates, mixtures, copolymers, and grafts thereof.

10. The method of claim 8, wherein the RFID tag has an inductive antenna configured to communicate with an interrogator using a wireless communication technique.

11. The method of claim 8, wherein the distance is between about 200 μ

m to about 500 μ

m from the polishing surface.

12. The method of claim 8, further comprising:

forming a recess within the polymeric body, wherein

the RFID tag is coupled to a surface of the recess formed within the polymeric body.

13. The method of claim 12, wherein the RFID tag comprises an electrically conductive polymer material comprising conductive nano-particles.

14. The method of claim 8, wherein the one or more polishing features are formed on the one or more base features, the one or more polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height.

15. A method of manufacturing a polishing pad apparatus, comprising:

forming a plurality of polishing features of a polymeric body by distributing a first material, wherein the plurality of polishing features are arranged in concentric rings and define a polishing surface configured to contact a substrate;

forming one or more base features of the polymeric body by distributing a second material that is different from the first material;

disposing a radio frequency identification (RFID) tag within the polymeric body and at a distance from the polishing surface; and

disposing a sensor that is communicatively coupled to the RFID tag within the polymeric body, wherein

the one or more base features are each disposed at a distance from the plurality of polishing features,

the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface, and

the RFID tag stores a plurality of information associated with two or more properties of the polymeric body.

16. The method of claim 15, wherein the first and second materials are selected from the group consisting of epoxies, phenolics, amines, polyesters, urethanes, silicon, acrylates, mixtures, copolymers, and grafts thereof.

17. The method of claim 15, wherein the RFID tag has an inductive antenna configured to communicate with an interrogator using a wireless communication technique.

18. The method of claim 15, wherein the distance is between about 200 μ

m to about 500 μ

m from the polishing surface.

19. The method of claim 15, wherein

the sensor is selected from the group consisting of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, and a pressure sensor, and the RFID tag is configured to communicate with an interrogator using a wireless communication technique.

20. The method of claim 15, further comprising:

forming a recess within the polymeric body, wherein

the RFID tag is coupled to a surface of the recess formed within the polymeric body, and

the RFID tag comprises an electrically conductive polymer material comprising conductive nano-particles.