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APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

  • US 20200135527A1
  • Filed: 05/02/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/30/2018
  • Status: Active Grant
First Claim
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1. A semiconductor processing apparatus comprising:

  • a chamber housing;

    an electrostatic chuck disposed in the chamber housing, the electrostatic chuck being configured to hold a semiconductor wafer;

    an edge ring surrounding the electrostatic chuck, the edge ring including a ring electrode disposed within the edge ring; and

    a ring voltage supply configured to supply a ring voltage to the ring electrode, the ring voltage having a non-sinusoidal periodic waveform,wherein each period of the non-sinusoidal periodic waveform comprises a positive voltage applied during a first time period and a negative voltage applied during a second time period, andwherein the negative voltage has a magnitude that increases during the second time period.

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