GRADED DIMPLE HEIGHT PATTERN ON HEATER FOR LOWER BACKSIDE DAMAGE AND LOW CHUCKING VOLTAGE

• US 20200135530A1
• Filed: 10/10/2019
• Published: 04/30/2020
• Est. Priority Date: 10/26/2018
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Shah, Vivek B., Kumar, Bhaskar, Balasubramanian, Ganesh
• Granted Patent: US 11,515,191 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H01L 21/68757 characterised by a coating or a hardness or a material
• CPC Class Codes: H05B 1/0233 for semiconductors manufacturing
• CPC Class Codes: H05B 2203/014 Heaters using resistive wires or cables not provided for in H05B3/54
• CPC Class Codes: H05B 3/283 the insulating material being an inorganic material, e.g. ceramic

Abstract

Embodiments disclosed herein may include a heater pedestal. In an embodiment, the heater pedestal may comprise a heater pedestal body and a conductive mesh embedded in the heater pedestal. In an embodiment, the conductive mesh is electrically coupled to a voltage source In an embodiment, the heater pedestal may further comprise a support surface on the heater pedestal body. In an embodiment, the support surface comprises a plurality of pillars extending out from the heater pedestal body and arranged in concentric rings. In an embodiment pillars in an outermost concentric ring have a height that is greater than a height of pillars in an innermost concentric ring.

Claims

1. An electrostatic chuck, comprising:

a chuck body; and

a support surface on the chuck body for supporting a substrate, wherein the support surface is non-planar.

2. The electrostatic chuck of claim 1, wherein the support surface comprises a plurality of protrusions.

3. The electrostatic chuck of claim 2, wherein the plurality of protrusions comprise a plurality of concentric rings.

4. The electrostatic chuck of claim 2, wherein the plurality of protrusions comprise a plurality of pillars.

5. The electrostatic chuck of claim 4, wherein the pillars are cylindrical pillars

6. The electrostatic chuck of claim 2, wherein the plurality of pillars are each covered by a conductive layer.

7. The electrostatic chuck of claim 2, wherein heights of the protrusions are non-uniform.

8. The electrostatic chuck of claim 7, wherein protrusions proximate to a center of the electrostatic chuck have a height that is less than a height of protrusions that are proximate to an edge of the electrostatic chuck.

9. The electrostatic chuck of claim 7, wherein protrusions proximate to a center of the electrostatic chuck have a height that is greater than a height of protrusions that are proximate to an edge of the electrostatic chuck.

10. The electrostatic chuck of claim 7, wherein a maximum difference between heights of the protrusions is 100 microns or greater.

11. The electrostatic chuck of claim 7, wherein a maximum difference between heights of the protrusions is 200 microns or greater.

12. The electrostatic chuck of claim 1, further comprising a conductive mesh embedded in the chuck body.

13. The electrostatic chuck of claim 12, wherein the electrostatic chuck is a heater.

14. A semiconductor manufacturing tool, comprising:

a heater pedestal;

a conductive mesh embedded in the heater pedestal, wherein the conductive mesh is electrically coupled to a voltage source; and

a support surface on the heater pedestal, the support surface being non-planar.

15. The semiconductor manufacturing tool of claim 14, wherein the support surface is concave.

16. The semiconductor manufacturing tool of claim 14, wherein the support surface is convex.

17. The semiconductor manufacturing tool of claim 14, wherein the support surface comprises a plurality of protrusions having non-uniform heights.

18. A heater pedestal, comprising:

a heater pedestal body;

a conductive mesh embedded in the heater pedestal body, wherein the conductive mesh is electrically coupled to a voltage source; and

a support surface on the heater pedestal body, wherein the support surface comprises a plurality of pillars extending out from the heater pedestal body and arranged in concentric rings, wherein pillars in an outermost concentric ring have a height that is greater than a height of pillars in an innermost concentric ring.

19. The heater pedestal of claim 18, wherein the support surface and the sidewalls of the pillars are covered by a conductive layer.

20. The heater pedestal of claim 18, wherein a difference between heights of the protrusions in the outermost concentric ring and the heights of the protrusions in the innermost concentric ring is 200 microns or greater.