Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly

• US 20200135534A1
• Filed: 12/24/2019
• Published: 04/30/2020
• Est. Priority Date: 08/05/2014
• Status: Active Grant

• Current Assignee: Kulicke and Soffa Industries Incorporated
• Original Assignee: Uniqarta, Inc. (Kulicke and Soffa Industries Incorporated)
• Inventors: Marinov, Val
• Granted Patent: US 10,937,680 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2037/268 Release layers
• CPC Class Codes: B32B 2038/0016 Abrading
• CPC Class Codes: B32B 2038/045 Slitting
• CPC Class Codes: B32B 2307/40 having particular optical properties
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/1858 using vacuum
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/75251 : in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75314 : Auxiliary members on the pressing surface
• CPC Class Codes: H01L 2224/75317 : Removable auxiliary member
• CPC Class Codes: H01L 2224/83005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83874 : Ultraviolet [UV] curing
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Claims

1. (canceled)

2. An apparatus comprising:

a handle substrate;

a release layer attached to the handle substrate;

a discrete component attached to the release layer

in which the release layer is configured to undergo a change in state at least partially concurrently with a change in state of an adhesive layer attached to a device substrate, in which the change in state of the release layer is a change to a state in which the release layer has an adhesion that is not sufficient to adhere the discrete component to the handle substrate, and in which the change in state of the adhesive layer is a change to a state in which the adhesive layer has an adhesion that is sufficient to adhere the discrete component to the device substrate.

3. The apparatus of claim 2, in which the discrete component has an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration.

4. The apparatus of claim 2, in which at least one side of the handle substrate has a length longer than at least one side of the discrete component.

5. The apparatus of claim 2, in which the release layer comprises multiple layers, wherein a first layer of the multiple layers is permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive

6. An apparatus comprising:

a handle substrate;

a release layer attached to the handle substrate, the release layer comprising multiple layers, wherein a first layer of the multiple layers is permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive;

a discrete component releasably attached to the handle substrate by the release layer, the discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, at least one side of the handle substrate having a length longer than at least one side of the discrete component.