DIE CARRIER PACKAGE AND METHOD OF FORMING SAME

• US 20200135597A1
• Filed: 10/30/2018
• Published: 04/30/2020
• Est. Priority Date: 10/30/2018
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Boone, Mark R., Henschel, Mark E.
• Granted Patent: US 10,950,511 B2
• Time in Patent Office: Days
• CPC Class Codes: A61B 2560/0462 Apparatus with built-in sensors
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 5/02427 Details of sensor
• CPC Class Codes: A61B 5/1459 invasive, e.g. introduced into the body by a catheter A61B5/1464 takes precedence
• CPC Class Codes: A61B 5/686 Permanently implanted devices, e.g. pacemakers, other stimulators, biochips A61B5/6861 takes precedence
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48248 : the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49113 : the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/83851 : being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/85214 : using a laser
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/055 : the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/12 : Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 23/13 : characterised by the shape
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/49866 : characterised by the materials materials of the substrates H01L23/14, of the lead-frames H01L23/49579
• CPC Class Codes: H01L 23/5386 : Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 24/01 : Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/15156 : Side view
• CPC Class Codes: H01L 2924/15157 : Top view
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15323 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/125 : Composite devices with photosensitive elements and electroluminescent elements within one single body
• CPC Class Codes: H01L 33/483 : Containers

Abstract

Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.

Claims

1. A die carrier package, comprising:

a carrier substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;

a first package contact disposed on the first major surface of the carrier substrate adjacent the cavity and electrically connected to a first die pad disposed on the recessed surface via a first conductor;

a second package contact disposed on the first major surface of the carrier substrate adjacent the cavity and electrically connected to a second die pad disposed on the recessed surface via a second conductor; and

a die disposed within the cavity of the carrier substrate and comprising a first die contact disposed on an active surface of the die and a second die contact disposed on a major surface of the die that faces the recessed surface and that is opposed to the active surface, wherein the first die contact is electrically connected to the first die pad and the second die contact is electrically connected to the second die pad.

2. The package of claim 1, wherein the second die contact is disposed on the second die pad.

3. The package of claim 1, wherein the first die contact is wire-bonded to the first die pad by a wire that is disposed within the cavity, wherein the die and the wire are disposed below a plane defined by the first major surface of the carrier substrate.

4. The package of claim 1, wherein the die has a height measured in a direction orthogonal to the recessed surface and the cavity has a depth from the first major surface of the carrier substrate measured in a direction orthogonal to the recessed surface, wherein the cavity depth is greater than the height of the die.

5. The package of claim 1, further comprising solder bumps disposed on and electrically connected to each of the first and second package contacts.

6. The package of claim 1, further comprising a dielectric layer disposed on a portion of the recessed surface between the first and second die pads and the carrier substrate.

7. The package of claim 6, wherein the dielectric layer is further disposed between the first and second conductors and the carrier substrate.

8. The package of claim 1, wherein the cavity further comprises a sidewall that connects the recessed surface of the cavity to the first major surface of the carrier substrate.

9. The package of claim 1, wherein at least one of the first and second conductors, the first and second die pads, and the first and second package contacts comprises first and second metal layers.

10. The package of claim 9, wherein the first metal layer comprises at least one of Al, Cu, Ag, and Au.

11. The package of claim 10, wherein the second metal layer comprises at least one of Ti, NiV, and Au.

12. The package of claim 1, further comprising an encapsulant disposed in the cavity over the die.

13. The package of claim 1, further comprising a second die disposed within the cavity of the carrier substrate and comprising a first die contact disposed on an active surface of the second die and a second die contact disposed on a major surface of the second die that faces the recessed surface and that is opposed to the active surface, wherein the first die contact is electrically connected to the first die pad and the second die contact is electrically connected to a third die pad disposed on the recessed surface, wherein the third die pad is electrically connected to a third package contact disposed on the first major surface of the carrier substrate adjacent the cavity, wherein the third package contact is electrically connected to the third die pad by a third conductor.

14. A method of forming a die carrier package, comprising:

forming a cavity in a first major surface of a carrier substrate, wherein the cavity comprises a recessed surface;

forming a patterned conductive layer on the recessed surface of the cavity and the first major surface of the carrier substrate, wherein the first patterned conductive layer comprises first and second package contacts disposed on the first major surface of the carrier substrate adjacent the cavity and first and second die pads disposed on the recessed surface of the cavity, wherein the first package contact is electrically connected to the first die pad by a first conductor and the second package contact is electrically connected to the second die pad by a second conductor;

disposing a die within the cavity;

electrically connecting a first die contact of the die to the first die pad of the patterned conductive layer, wherein the first die contact is disposed on an active surface of the die; and

electrically connecting a second die contact of the die to the second die pad of the patterned conductive layer, wherein the second die contact is disposed on a major surface of the die that faces the recessed surface and is opposed to the active surface;

wherein the first and second conductors of the patterned conductive layer extend between the recessed surface of the cavity and the first major surface of the carrier substrate adjacent the cavity.

15. The method of claim 14, wherein forming the patterned conductive layer comprises:

disposing a first metal layer on at least a portion of the recessed surface of the cavity and the first major surface of the carrier substrate;

patterning a portion of the first metal layer;

disposing a second metal layer on the patterned first metal layer; and

patterning a portion of the second metal layer such that the patterned portion of the first metal layer is registered with the patterned portion of the second metal layer.

16. The method of claim 14, further comprising disposing solder bumps on each of the first and second package contacts.

17. The method of claim 14, further comprising disposing an encapsulant over the die and within the cavity

18. The method of claim 14, wherein electrically connecting the first die contact to the first die pad comprises wire-bonding the first die contact to the first die pad.

19. A hermetically-sealed system, comprising:

a housing comprising an inner surface and an outer surface;

a device substrate hermetically sealed to the housing and comprising a first major surface and a second major surface;

a die carrier package disposed on the first major surface of the device substrate and comprising a die that comprises an active surface facing the device substrate, wherein the die is adapted to emit light through the first and second major surfaces of the device substrate, wherein the die is disposed within a cavity of a carrier substrate of the package, wherein the die further comprises a first die contact disposed on the active surface of the die and a second die contact disposed on a major surface of the die that faces a recessed surface of the cavity of the die carrier package and that is opposed to the active surface, wherein the first die contact is electrically connected to a first package contact disposed on a first major surface of the carrier substrate of the package adjacent the cavity and the second die contact is electrically connected to a second package contact disposed on the first major surface of the carrier substrate of the package adjacent the cavity, wherein the first and second package contacts are disposed between the first major surface of the carrier substrate and the first and second major surfaces of the device substrate; and

a detector disposed on the first major surface of the device substrate and comprising a detecting surface, wherein the detector is adapted to detect at least a portion of the light emitted by the die.

20. The system of claim 19, wherein the first and second package contacts are electrically connected to a patterned conductive layer disposed on the first major surface of the device substrate.