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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

  • US 20200135599A1
  • Filed: 10/24/2018
  • Published: 04/30/2020
  • Est. Priority Date: 10/24/2018
  • Status: Active Grant
First Claim
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1. A semiconductor chip structure, comprising:

  • a substrate having a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface, wherein the lateral surface comprises;

    a first portion having a first surface roughness and being in proximity to the top surface; and

    a second portion having a second surface roughness and being in proximity to the bottom surface,wherein the first surface roughness is greater than the second surface roughness.

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