SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
First Claim
Patent Images
1. A semiconductor chip structure, comprising:
- a substrate having a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface, wherein the lateral surface comprises;
a first portion having a first surface roughness and being in proximity to the top surface; and
a second portion having a second surface roughness and being in proximity to the bottom surface,wherein the first surface roughness is greater than the second surface roughness.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip structure includes a substrate having a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface. The lateral surface includes a first portion having a first surface roughness and being in proximity to the top surface, and a second portion having a second surface roughness and being in proximity to the bottom surface. The first surface roughness is greater than the second surface roughness. A method for manufacturing the semiconductor chip structure is also provided.
1 Citation
30 Claims
-
1. A semiconductor chip structure, comprising:
-
a substrate having a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface, wherein the lateral surface comprises; a first portion having a first surface roughness and being in proximity to the top surface; and a second portion having a second surface roughness and being in proximity to the bottom surface, wherein the first surface roughness is greater than the second surface roughness. - View Dependent Claims (2, 3, 4, 5, 6, 21, 22, 23)
-
-
7. A semiconductor package, comprising:
-
a substrate having a top surface and a bottom surface; an active region in proximity to the top surface; and an inactive region surrounding the active region, wherein the inactive region comprises; a first lateral surface; a second lateral surface; and a peak connecting the first lateral surface and the second lateral surface. - View Dependent Claims (8, 9, 10, 24, 25, 26, 27, 28, 29, 30)
-
-
11-20. -20. (canceled)
Specification