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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

  • US 20200135604A1
  • Filed: 10/29/2018
  • Published: 04/30/2020
  • Est. Priority Date: 10/29/2018
  • Status: Active Grant
First Claim
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1. A semiconductor package structure, comprising:

  • a patterned conductive layer, having a front surface, a back surface, and a side surface connecting the front surface and the back surface;

    a first semiconductor chip on the front surface and electrically connected to the patterned conductive layer;

    a first encapsulant covering at least the back surface of the patterned conductive layer; and

    a second encapsulant covering at least the front surface of the patterned conductive layer, the side surface being covered by one of the first encapsulant and the second encapsulant.

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