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SEMICONDUCTOR DEVICE

  • US 20200135607A1
  • Filed: 09/18/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/24/2018
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a wiring substrate having a first surface;

    a first semiconductor chip and a second semiconductor chip disposed on the first surface; and

    a heat sink having a second surface which faces the first surface and a third surface opposite the second surface, and disposed over the first surface such that the heat sink is disposed on the first semiconductor chip,wherein the heat sink has a first cut-out portion which is formed at a position overlapping the second semiconductor chip in plan view,wherein the first cut-out portion penetrates the heat sink plate in a direction from the third surface toward the second surface, andwherein the second surface of the heat sink is bonded to at least four corners of the first surface of the wiring substrate.

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