SEMICONDUCTOR STRUCTURE
First Claim
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1. A semiconductor structure, comprising:
- a substrate;
a block bonded on the substrate;
a first die bonded on the block;
a second die disposed over the first die; and
a heat spreader covering the block and having a surface facing toward and proximal to the block;
wherein a thermal conductivity of the heat spreader is higher than a thermal conductivity of the block.
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Abstract
The present disclosure provides a semiconductor structure. The semiconductor includes a substrate, a block bonded on the substrate, a first die bonded on the block, a second die disposed over the first die, and a heat spreader covering the block and having a surface facing toward and proximal to the block. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the block.
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Citations
20 Claims
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1. A semiconductor structure, comprising:
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a substrate; a block bonded on the substrate; a first die bonded on the block; a second die disposed over the first die; and a heat spreader covering the block and having a surface facing toward and proximal to the block; wherein a thermal conductivity of the heat spreader is higher than a thermal conductivity of the block. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor structure, comprising:
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a substrate; a block bonded on the substrate; a die stack, disposed over the block; and a heat spreader having a surface facing toward and proximal to the die stack, wherein the surface of the heat spreader is conformal to a topography of the die stack, and wherein a thermal conductivity of the heat spreader is higher than a thermal conductivity of the block. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor structure, comprising:
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a substrate; a block bonded on the substrate; a plurality of dies, disposed over the block; a heat spreader having a surface facing toward and proximal to the plurality of dies; and a thermal interface material (TIM) disposed between the plurality of dies and the heat spreader, wherein the TIM is in contact with a sidewall of a topmost die of the plurality of dies and the heat spreader, and wherein a thermal conductivity of the heat spreader is higher than a thermal conductivity of the block. - View Dependent Claims (19, 20)
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Specification