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SEMICONDUCTOR STRUCTURE

  • US 20200135610A1
  • Filed: 12/23/2019
  • Published: 04/30/2020
  • Est. Priority Date: 11/14/2017
  • Status: Active Grant
First Claim
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1. A semiconductor structure, comprising:

  • a substrate;

    a block bonded on the substrate;

    a first die bonded on the block;

    a second die disposed over the first die; and

    a heat spreader covering the block and having a surface facing toward and proximal to the block;

    wherein a thermal conductivity of the heat spreader is higher than a thermal conductivity of the block.

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