POWER MODULE SUBSTRATE AND POWER MODULE

• US 20200135612A1
• Filed: 05/22/2018
• Published: 04/30/2020
• Est. Priority Date: 06/28/2017
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: KONISHI, Yoshitada
• Granted Patent: US 11,195,776 B2
• Time in Patent Office: Days
• CPC Class Codes: C04B 2235/963 Surface properties, e.g. surface roughness
• CPC Class Codes: C04B 2237/121 based on aluminium
• CPC Class Codes: C04B 2237/125 based on noble metals, e.g. silver
• CPC Class Codes: C04B 2237/126 wherein the active component for bonding is not the largest fraction of the interlayer
• CPC Class Codes: C04B 2237/127 The active component for bonding being a refractory metal
• CPC Class Codes: C04B 2237/128 The active component for bonding being silicon
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/365 Silicon carbide
• CPC Class Codes: C04B 2237/366 Aluminium nitride
• CPC Class Codes: C04B 2237/368 Silicon nitride
• CPC Class Codes: C04B 2237/402 Aluminium
• CPC Class Codes: C04B 2237/407 Copper
• CPC Class Codes: C04B 2237/704 of one or more of the ceramic layers or articles
• CPC Class Codes: C04B 2237/86 Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
• CPC Class Codes: C04B 2237/88 Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
• CPC Class Codes: C04B 37/026 consisting of metals or metal salts
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 : the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/85439 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/85455 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/85464 : Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 23/3735 : Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/38 : Improvement of the adhesion between the insulating substrate and the metal

Abstract

A power module substrate includes an insulating substrate and a metal plate. The metal plate is joined to the insulating substrate with a brazing material in between. As to surface roughness of a lateral surface of the metal plate in a thickness direction, the surface roughness of at least a corner part farthest from a center of the metal plate in plan view is larger than the surface roughness of plane parts sandwiching the corner part.

Claims

1. A power module substrate comprising:

an insulating substrate; and

a metal plate joined to the insulating substrate with a brazing material in between, wherein

as to surface roughness of a lateral surface of the metal plate in a thickness direction, the surface roughness of at least a corner part farthest from a center of the metal plate in plan view is larger than the surface roughness of plane parts sandwiching the corner part.

2. The power module substrate according to claim 1, wherein the surface roughness gradually increases from the plane parts to the corner part.

3. The power module substrate according to claim 1 or 2, wherein the corner part is convex in plan view.

4. A power module comprising:

the power module substrate according to any one of claims 1 to 3; and

an electronic component mounted on the metal plate of the power module substrate.