HEAT SINKS WITH VIBRATION ENHANCED HEAT TRANSFER FOR NON-LIQUID HEAT SOURCES

• US 20200135614A1
• Filed: 10/25/2019
• Published: 04/30/2020
• Est. Priority Date: 10/25/2018
• Status: Active Grant

• Current Assignee: United Arab Emirates University (Al Hikma Development Co. PJSC)
• Original Assignee: United Arab Emirates University (Al Hikma Development Co. PJSC)
• Inventors: AL OMARI, SALAH ADDIN BURHAN, ELNAJJAR, EMAD
• Granted Patent: US 10,866,038 B2
• Time in Patent Office: Days
• CPC Class Codes: F28D 20/02 using latent heat
• CPC Class Codes: F28D 20/021 the latent heat storage material and the heat-exchanging means being enclosed in one container F28D20/023 - F28D20/028 take precedence
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 21/00 Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
• CPC Class Codes: F28F 13/10 by imparting a pulsating motion to the flow, e.g. by sonic vibration
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: Y02E 60/14 Thermal energy storage

Abstract

The heat sinks with vibration enhanced heat transfer for non-liquid heat sources are heat sinks formed from a first body of high thermal conductivity material received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be any non-liquid heat source, including a processor chip, an integrated circuit chip, a modular circuit package, or the like. The thermally conductive housing may be disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. Alternatively, the vibrating base may be attached to a support attached to the heat source. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.

Claims

1. A heat sink with vibration enhanced heat transfer for non-liquid heat sources, comprising:

a thermally conductive housing having at least one contact face and at least one wall;

a first body of high thermal conductivity material disposed within the thermally conductive housing, the first body of high thermal conductivity material having at least one contact face adapted for direct contact with a non-liquid heat source to be cooled; and

a vibrating base, the vibrating base disposed in direct contact with the at least one contact face of the thermally conductive housing;

wherein the vibrating base is configured to propagate oscillating waves through the thermally conductive housing and the first body of high thermal conductivity material to reach the at least one contact face adapted for direct contact with the non-liquid heat source; and

wherein the first body of high thermal conductivity material is capable of forming an at least partially liquid conductive melted high thermal conductivity material layer in direct contact with the heat source.

2. The heat sink as recited in claim 1, further comprising a plurality of thermally conductive fins mounted on at least a portion of the at least one wall of the thermally conductive housing.

3. The heat sink as recited in claim 1, further comprising at least one tube having opposed first and second ends, wherein the tube is positioned in and traverses the thermally conductive housing such that the opposed first and second ends of the at least one tube are positioned outside of the thermally conductive housing.

4. The heat sink as recited in claim 3, further comprising a plurality of thermally conductive fins mounted on at least a portion of the at least one tube.

5. The heat sink as recited in claim 1, further comprising at least one thermally conductive vertical stud having opposed first and second ends, wherein the first end of the vertical stud is affixed within the at least one contact face of the thermally conductive housing and the first end of the vertical stud is in direct contact with the vibrating base.

6. The heat sink as recited in claim 5, further comprising at least one internal chamber within the at least one thermally conductive vertical stud, and a body of high thermal storage capacity material within the at least one internal chamber.

7. The heat sink as recited in claim 5, further comprising a plurality of fins mounted on at least a portion of the at least one thermally conductive vertical stud, wherein the plurality of fins are constructed of a material selected from the group consisting of a flexible material and a rigid material.

8. The heat sink as recited in claim 1, wherein the first body of high thermal conductivity material is a solid phase change material.

9. The heat sink as recited in claim 8, further comprising at least one sensor positioned on the thermally conductive housing to detect melting of the first body of high thermal conductivity material at the contact face adapted for direct contact with the non-liquid heat source to be cooled.

10. The heat sink as recited in claim 8, wherein the solid phase change material has a melting point between the temperature of the external environment and the maximum operating temperature of the heat source and wherein the solid phase change material has a melting point within the target operating temperature range for the heat source.

11. The heat sink as recited in claim 1, wherein the first body of high thermal conductivity material is a liquid.

12. The heat sink as recited in claim 1, wherein the non-liquid heat source is selected from the group consisting of a processor chip, an integrated circuit chip, and a modular circuit package.

13. The heat sink as recited in claim 1, wherein the vibrating base is configured to propagate the oscillating waves intermittently or continuously.

14. A heat sink with vibration enhanced heat transfer for non-liquid heat sources, comprising:

a thermally conductive housing having at least one wall;

a first body of high thermal conductivity material disposed within the thermally conductive housing, the first body of high thermal conductivity material having at least one contact face adapted for direct contact with a non-liquid heat source to be cooled;

at least one support attached to the non-liquid heat source to be cooled; and

at least one vibrating base, the at least one vibrating base disposed in direct contact with the at least one support;

wherein the vibrating base is configured to propagate oscillating waves through the at least one support and the non-liquid heat source to be cooled to reach the at least one contact face adapted for direct contact with the first body of high thermal conductivity material.

15. The heat sink as recited in claim 14, further comprising a plurality of thermally conductive fins mounted on at least a portion of the at least one wall of the thermally conductive housing.

16. The heat sink as recited in claim 14, further comprising at least one tube having opposed first and second ends, wherein the opposed first and second ends of the at least one tube are positioned outside of the thermally conductive housing.

17. The heat sink as recited in claim 14, wherein the first body of high thermal conductivity material is a solid phase change material.

18. The heat sink as recited in claim 17, further comprising at least one sensor positioned on the thermally conductive housing to detect melting of the first body of high thermal conductivity material at the contact face adapted for direct contact with a non-liquid heat source to be cooled.

19. The heat sink as recited in claim 17, wherein the first body of high thermal conductivity material is a liquid.

20. The heat sink as recited in claim 14, wherein the non-liquid heat source is selected from the group consisting of a processor chip, an integrated circuit chip, and a modular circuit package.