CHOKED FLOW COOLING

• US 20200135616A1
• Filed: 10/31/2018
• Published: 04/30/2020
• Est. Priority Date: 10/31/2018
• Status: Active Grant

• Current Assignee: SK Hynix NAND Product Solutions Corporation (SK Hynix Inc.)
• Original Assignee: Intel Corporation
• Inventors: FORSNES, Mark, CAI, Yuhong, PON, Florence, XU, Yi
• Granted Patent: US 11,901,264 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/538 the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866

Abstract

Embodiments disclosed herein include electronic packages with chocked flow cooling. In an embodiment, an electronic package may comprise a package substrate, a die electrically and mechanically coupled to the package substrate, and a lid over the die. In an embodiment, the lid has a first opening and a second opening that is opposite from the first opening. In an embodiment, the electronic package may further comprise a coolant plate covering the first opening. In an embodiment, the coolant plate comprises a first surface facing away from the die and a second surface facing the die, and a plurality of vents from the first surface to the second surface. In an embodiment, the first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension.

Claims

1. An electronic package, comprising:

a package substrate;

a die electrically and mechanically coupled to the package substrate;

a lid over the die, wherein the lid has a first opening and a second opening that is opposite from the first opening; and

a coolant plate covering the first opening, wherein the coolant plate comprises a first surface facing away from the die and a second surface facing the die, and a plurality of vents from the first surface to the second surface, wherein first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension.

2. The electronic package of claim 1, wherein the first dimension is a diameter and the second dimension is a diameter.

3. The electronic package of claim 2, wherein the second dimension is half the first dimension or less.

4. The electronic package of claim 1, wherein the vents have a continuously decreasing dimension from the first surface to the second surface.

5. The electronic package of claim 1, wherein a decrease of the dimension of the vents from the first dimension to the second dimension is reached before the second surface.

6. The electronic package of claim 1, further comprising:

a fan attached to the coolant plate.

7. The electronic package of claim 1, further comprising:

a thermal solution attached to the die.

8. The electronic package of claim 1, wherein the thermal solution comprises cooling fins.

9. The electronic package of claim 8, wherein the cooling fins contact the lid.

10. The electronic package of claim 1, further comprising:

a plurality of dies electrically and mechanically coupled to the package substrate.

11. The electronic package of claim 1, wherein the die is a memory die.

12. The electronic package of claim 11, wherein the memory die is a NAND device.

13. The electronic package of claim 1, wherein the die is a graphics processor unit (GPU).

14. A coolant plate for an electronic package, comprising:

a first surface;

a second surface opposite from the first surface; and

a plurality of vents from the first surface to the second surface, the vents having a first opening at the first surface with a first dimension and a second opening at the second surface with a second dimension that is smaller than the first dimension.

15. The coolant plate of claim 14, wherein the vents have a substantially circular shape.

16. The coolant plate of claim 15, wherein the first dimension is a diameter and the second dimension is a diameter.

17. The coolant plate of claim 14, wherein the vents have a substantially rectangular shape.

18. The coolant plate of claim 14, wherein the second dimension is half the first dimension or less.

19. The coolant plate of claim 14, wherein the coolant plate is part of a lid for an electronic package.

20. The coolant plate of claim 14, further comprising a plurality of fans attached to the first surface of the coolant plate.

21. The coolant plate of claim 14, wherein the vents have a continuously decreasing dimension from the first surface to the second surface.

22. The coolant plate of claim 14, wherein a decrease of the dimension of the vents from the first dimension to the second dimension is reached before the second surface.

23. An electronic package, comprising:

a package substrate;

a die coupled to the package substrate;

a thermal solution on the die;

a lid over the die, wherein the lid has a first opening and a second opening opposite the first opening; and

a coolant plate covering the first opening, wherein the coolant plate comprises a plurality of vents with a non-uniform cross-section.

24. The electronic package of claim 23, wherein the vents comprise first openings with a first diameter and second openings with a second diameter.

25. The electronic package of claim 24, wherein the second diameter is half the first diameter or less.