QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH LEAD
1 Assignment
0 Petitions
Accused Products
Abstract
The present disclosure is directed to a leadframe package having solder wettable sidewalls that is formed using a pre-molded leadframe and methods of manufacturing the same. A metal plated leadframe with a plurality of recesses and a plurality of apertures is placed into a top and bottom mold tool. A molding compound is then formed in the plurality of recesses and apertures in the leadframe to form a pre-molded leadframe. A plurality of die and wires are coupled to the pre-molded leadframe and the resulting combination is covered in an encapsulant. Alternatively, a bare leadframe can be processed and the metal layer can be applied after encapsulation. A saw or other cutting means is used for singulation to form leadframe packages. Each resulting leadframe package has a solder wettable sidewall for improving the strength of solder joints between the package and a circuit board.
1 Citation
21 Claims
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1. (canceled)
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2. A method, comprising:
forming a pre-molded leadframe by; positioning a first side of a leadframe on a first mold tool, the leadframe having a plurality of first recesses and a plurality of apertures, each first recess of the plurality of first recesses having a size and a shape configured to receive one of a plurality of ridges of the first mold tool, the leadframe also having a plurality of die pads and a plurality of leads; positioning a second mold tool on a second side of the leadframe, the second mold tool having a plurality of second recesses; forming a plurality of first molding compound portions in the plurality of apertures; and forming a plurality of second molding compound portions in the plurality of second recesses. - View Dependent Claims (3, 4, 5, 6, 7, 8)
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9. A device, comprising:
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a leadframe including a first surface, a second surface opposite the first surface, a die pad, and a first lead; a first molding compound portion between the die pad and the first lead, the first molding compound portion including a third surface substantially co-planar with the first surface, and a fourth surface substantially co-planar with the second surface; a second molding compound portion on the first surface of the lead; and an encapsulant on the first surface of the leadframe, on the fourth surface of the first molding compound portion, and on the second molding portion. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A device, comprising:
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a leadframe including; a first surface and a second surface opposite the first surface; a die pad; and a first lead including a first flange, the first flange including a first exposed surface transverse the first surface and the second surface; a first molding compound portion separates the die pad from the first lead; a second molding compound portion on the first surface of the leadframe and on the first lead; and an encapsulant on the first surface of the leadframe, on the first molding compound portion, and on the second molding compound portion. - View Dependent Claims (18, 19, 20, 21)
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Specification