SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
First Claim
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1. A method for fabricating semiconductor device, comprising:
- providing a substrate;
forming a gate structure on the substrate;
forming an epitaxial layer adjacent to the gate structure;
forming an interlayer dielectric (ILD) layer on the gate structure;
forming a first contact hole in the ILD layer adjacent to the gate structure; and
forming a cap layer in the recess, wherein a top surface of the cap layer is even with or lower than a top surface of the substrate.
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Abstract
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a gate structure on the substrate; forming an epitaxial layer adjacent to the gate structure; forming an interlayer dielectric (ILD) layer on the gate structure; forming a first contact hole in the ILD layer adjacent to the gate structure; and forming a cap layer in the recess, in which a top surface of the cap layer is even with or lower than a top surface of the substrate.
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Citations
11 Claims
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1. A method for fabricating semiconductor device, comprising:
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providing a substrate; forming a gate structure on the substrate; forming an epitaxial layer adjacent to the gate structure; forming an interlayer dielectric (ILD) layer on the gate structure; forming a first contact hole in the ILD layer adjacent to the gate structure; and forming a cap layer in the recess, wherein a top surface of the cap layer is even with or lower than a top surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification