CHIP PACKAGE WITH FAN-OUT STRUCTURE
First Claim
1. A chip package, comprising:
- a semiconductor die;
a protection layer surrounding the semiconductor die;
a first dielectric layer over the semiconductor die and the protection layer, wherein the first dielectric layer has an upper surface with cutting scratches;
a conductive layer over the first dielectric layer; and
a second dielectric layer over the conductive layer and filling some of the cutting scratches, wherein bottoms of the cutting scratches are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die.
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Accused Products
Abstract
A chip package is provided. The chip package includes a semiconductor die and a protection layer surrounding the semiconductor die. The chip package also includes a first dielectric layer over the semiconductor die and the protection layer. The first dielectric layer has an upper surface with cutting scratches. The chip package further includes a conductive layer over the first dielectric layer. In addition, the chip package includes a second dielectric layer over the conductive layer and filling some of the cutting scratches. Bottoms of the cutting scratches are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die.
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20 Claims
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1. A chip package, comprising:
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a semiconductor die; a protection layer surrounding the semiconductor die; a first dielectric layer over the semiconductor die and the protection layer, wherein the first dielectric layer has an upper surface with cutting scratches; a conductive layer over the first dielectric layer; and a second dielectric layer over the conductive layer and filling some of the cutting scratches, wherein bottoms of the cutting scratches are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A chip package, comprising:
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a semiconductor die; a protection layer surrounding the semiconductor die; a first dielectric layer over the semiconductor die and the protection layer; a conductive layer over the first dielectric layer; and a second dielectric layer over the first dielectric layer and the conductive layer, wherein the second dielectric layer has a plurality of protruding portions extending into the first dielectric layer, and bottoms of the protruding portions are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die. - View Dependent Claims (12, 13, 14, 15)
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16. A chip package, comprising:
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a semiconductor die; a protection layer surrounding the semiconductor die; a first dielectric layer over the semiconductor die and the protection layer; and a conductive layer over the first dielectric layer; and a second dielectric layer over the first dielectric layer and the conductive layer, wherein an interface between the second dielectric layer and the first dielectric layer has an undulate morphology, and bottoms of the interface with the undulated morphology are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die. - View Dependent Claims (17, 18, 19, 20)
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Specification