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PACKAGE STRUCTURE

  • US 20200135661A1
  • Filed: 12/31/2019
  • Published: 04/30/2020
  • Est. Priority Date: 12/13/2016
  • Status: Active Grant
First Claim
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1. A package structure, comprising:

  • an adhesive layer;

    a semiconductor substrate over the adhesive layer;

    a connector over the semiconductor substrate;

    a first buffer layer surrounding the connector;

    an encapsulation layer surrounding the first buffer layer, wherein the first buffer layer is sandwiched between the encapsulation layer and the semiconductor substrate, and a sidewall of the encapsulation layer is in direct contact with a sidewall of the first buffer layer and a sidewall of the adhesive layer; and

    a redistribution layer over the first buffer layer and the encapsulation layer.

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