FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD
First Claim
1. A fan-out antenna packaging method, comprising the following steps:
- providing a supporting substrate, and forming a separating layer on the supporting substrate;
providing a semiconductor chip, and jointing a front surface of the semiconductor chip to a top surface of the separating layer;
disposing a packaging layer around side surfaces and a bottom surface of the semiconductor chip, wherein the packaging layer comprises a first surface in contact with the separating layer and a second surface opposite to the first surface;
pulling out the packaging layer from the separating layer to expose the front surface of the semiconductor chip;
forming a rewiring layer on the first surface of the packaging layer, wherein the rewiring layer is electrically connected to the semiconductor chip;
forming a first antenna structure on a top surface of the rewiring layer, wherein the first antenna structure is electrically connected to the rewiring layer, wherein the first antenna structure comprises a first antenna metal connecting block, a first antenna metal connecting column, a first antenna packaging layer, and a first antenna metal layer, wherein the first antenna metal layer is aligned with the first antenna metal column which is aligned with the first antenna metal block;
forming a second antenna structure on the first antenna structure, wherein the second antenna structure comprises a second antenna metal connecting block, a second antenna metal connecting column, a second antenna packaging layer, and a second antenna metal layer, wherein the second antenna block overlays the first antenna metal layer, wherein the second antenna metal layer is aligned with the second antenna metal column which is aligned with the second antenna metal block;
running through the packaging layer to form a through hole, wherein the through hole exposes a metal wiring layer in the rewiring layer; and
forming, by using the through hole, a metal bump electrically connected to the metal wiring layer.
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Accused Products
Abstract
Disclosed is a fan-out antenna packaging method. A front surface of a semiconductor chip is jointed to a top surface of a separating layer; side surfaces and a bottom surface of the semiconductor chip are merged into a packaging layer; the packaging layer is separated from the separating layer to expose the front surface of the semiconductor chip; a rewiring layer is electrically connected to the semiconductor chip; a first antenna structure and a second antenna are stacked on a top surface of the rewiring layer, the antenna structures is electrically connected to the rewiring layer; a through hole runs through the packaging layer and exposes a metal wiring layer in the rewiring layer; and a metal bump electrically connected to the metal wiring layer is formed by using the through hole.
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Citations
16 Claims
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1. A fan-out antenna packaging method, comprising the following steps:
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providing a supporting substrate, and forming a separating layer on the supporting substrate; providing a semiconductor chip, and jointing a front surface of the semiconductor chip to a top surface of the separating layer; disposing a packaging layer around side surfaces and a bottom surface of the semiconductor chip, wherein the packaging layer comprises a first surface in contact with the separating layer and a second surface opposite to the first surface; pulling out the packaging layer from the separating layer to expose the front surface of the semiconductor chip; forming a rewiring layer on the first surface of the packaging layer, wherein the rewiring layer is electrically connected to the semiconductor chip; forming a first antenna structure on a top surface of the rewiring layer, wherein the first antenna structure is electrically connected to the rewiring layer, wherein the first antenna structure comprises a first antenna metal connecting block, a first antenna metal connecting column, a first antenna packaging layer, and a first antenna metal layer, wherein the first antenna metal layer is aligned with the first antenna metal column which is aligned with the first antenna metal block; forming a second antenna structure on the first antenna structure, wherein the second antenna structure comprises a second antenna metal connecting block, a second antenna metal connecting column, a second antenna packaging layer, and a second antenna metal layer, wherein the second antenna block overlays the first antenna metal layer, wherein the second antenna metal layer is aligned with the second antenna metal column which is aligned with the second antenna metal block; running through the packaging layer to form a through hole, wherein the through hole exposes a metal wiring layer in the rewiring layer; and forming, by using the through hole, a metal bump electrically connected to the metal wiring layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A fan-out antenna packaging structure, comprising:
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a rewiring layer, comprising a first surface and a second surface opposite to the first surface; a first antenna structure, is located on the second surface of the rewiring layer and electrically connected to a metal wiring layer in the rewiring layer, wherein the first antenna structure comprises a first antenna metal connecting block, a first antenna metal connecting column, a first antenna packaging layer, and a first antenna metal layer, wherein the first antenna metal layer is aligned with the first antenna metal column which is aligned with the first antenna metal block; a second antenna structure disposed on the first antenna structure, wherein the second antenna structure comprises a second antenna metal connecting block, a second antenna metal connecting column, a second antenna packaging layer, and a second antenna metal layer, wherein the second antenna block overlays the first antenna metal layer, wherein the second antenna metal layer is aligned with the second antenna metal column which is aligned with the second antenna metal block;
a semiconductor chip located on the first surface of the rewiring layer, wherein a front surface of the semiconductor chip is electrically connected to the rewiring layer;a packaging layer, surrounding side surfaces and a bottom surface of the semiconductor chip and comprising a through hole that exposes the metal wiring layer; and a metal bump, electrically connected to the metal wiring layer through the through hole. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification