FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD

• US 20200135671A1
• Filed: 05/15/2019
• Published: 04/30/2020
• Est. Priority Date: 10/26/2018
• Status: Active Grant

• Current Assignee: SJ Semiconductor (Jiangyin) Corporation (Semiconductor Manufacturing International Corporation)
• Original Assignee: SJ Semiconductor (Jiangyin) Corporation (Semiconductor Manufacturing International Corporation)
• Inventors: Chen, Yenheng, Lin, Chengchung
• Granted Patent: US 11,211,343 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4875 Connection or disconnection of other leads to or from bases or plates
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

Disclosed is a fan-out antenna packaging method. A front surface of a semiconductor chip is jointed to a top surface of a separating layer; side surfaces and a bottom surface of the semiconductor chip are merged into a packaging layer; the packaging layer is separated from the separating layer to expose the front surface of the semiconductor chip; a rewiring layer is electrically connected to the semiconductor chip; a first antenna structure and a second antenna are stacked on a top surface of the rewiring layer, the antenna structures is electrically connected to the rewiring layer; a through hole runs through the packaging layer and exposes a metal wiring layer in the rewiring layer; and a metal bump electrically connected to the metal wiring layer is formed by using the through hole.

Claims

1. A fan-out antenna packaging method, comprising the following steps:

providing a supporting substrate, and forming a separating layer on the supporting substrate;

providing a semiconductor chip, and jointing a front surface of the semiconductor chip to a top surface of the separating layer;

disposing a packaging layer around side surfaces and a bottom surface of the semiconductor chip, wherein the packaging layer comprises a first surface in contact with the separating layer and a second surface opposite to the first surface;

pulling out the packaging layer from the separating layer to expose the front surface of the semiconductor chip;

forming a rewiring layer on the first surface of the packaging layer, wherein the rewiring layer is electrically connected to the semiconductor chip;

forming a first antenna structure on a top surface of the rewiring layer, wherein the first antenna structure is electrically connected to the rewiring layer, wherein the first antenna structure comprises a first antenna metal connecting block, a first antenna metal connecting column, a first antenna packaging layer, and a first antenna metal layer, wherein the first antenna metal layer is aligned with the first antenna metal column which is aligned with the first antenna metal block;

forming a second antenna structure on the first antenna structure, wherein the second antenna structure comprises a second antenna metal connecting block, a second antenna metal connecting column, a second antenna packaging layer, and a second antenna metal layer, wherein the second antenna block overlays the first antenna metal layer, wherein the second antenna metal layer is aligned with the second antenna metal column which is aligned with the second antenna metal block;

running through the packaging layer to form a through hole, wherein the through hole exposes a metal wiring layer in the rewiring layer; and

forming, by using the through hole, a metal bump electrically connected to the metal wiring layer.

2. The fan-out antenna packaging method according to claim 1, further comprising a third antenna structure on a top surface of the second antenna structure comprising a third antenna metal connecting block, a third antenna metal connecting column, a third antenna packaging layer, and a third antenna metal layer, wherein the third antenna block overlays the second antenna metal layer, wherein the third antenna metal layer is aligned with the third antenna metal column which is aligned with the third antenna metal block.

3. The fan-out antenna packaging method according to claim 1, wherein the separating layer comprises an adhesive tape whose viscosity decreases upon heating or illumination.

4. The fan-out antenna packaging method according to claim 1, wherein the formed fan-out antenna packaging structure has a warpage level ranging from 0.1 mm to 3.0 mm.

5. The fan-out antenna packaging method according to claim 1, wherein a method for forming the through hole comprises one or a combination of laser drilling and dry etching.

6. The fan-out antenna packaging method according to claim 1, wherein the first antenna packaging layer surrounds the first antenna metal connecting column and exposes a top surface of the first antenna metal connecting column, and the first antenna metal layer is located on a top surface of the first antenna packaging layer and is electrically connected to the first antenna metal connecting column.

7. The fan-out antenna packaging method according to claim 2, wherein the first, second and third packaging layers each comprises an epoxy molding layer.

8. The fan-out antenna packaging method according to claim 2, wherein the first, second and third antenna structures each has a thickness ranging from 50 μ

m to 1000 μ

m.

9. The fan-out antenna packaging method according to claim 1, wherein the metal bump protrudes from the through hole.

10. A fan-out antenna packaging structure, comprising:

a rewiring layer, comprising a first surface and a second surface opposite to the first surface;

a first antenna structure, is located on the second surface of the rewiring layer and electrically connected to a metal wiring layer in the rewiring layer, wherein the first antenna structure comprises a first antenna metal connecting block, a first antenna metal connecting column, a first antenna packaging layer, and a first antenna metal layer, wherein the first antenna metal layer is aligned with the first antenna metal column which is aligned with the first antenna metal block;

a second antenna structure disposed on the first antenna structure, wherein the second antenna structure comprises a second antenna metal connecting block, a second antenna metal connecting column, a second antenna packaging layer, and a second antenna metal layer, wherein the second antenna block overlays the first antenna metal layer, wherein the second antenna metal layer is aligned with the second antenna metal column which is aligned with the second antenna metal block;

a semiconductor chip located on the first surface of the rewiring layer, wherein a front surface of the semiconductor chip is electrically connected to the rewiring layer;

a packaging layer, surrounding side surfaces and a bottom surface of the semiconductor chip and comprising a through hole that exposes the metal wiring layer; and

a metal bump, electrically connected to the metal wiring layer through the through hole.

11. The fan-out antenna packaging structure according to claim 10, wherein the second surface of the rewiring layer comprises a third antenna structure on a top surface of the second antenna structure comprising a third antenna metal connecting block, a third antenna metal connecting column, a third antenna packaging layer, and a third antenna metal layer, wherein the third antenna block overlays the second antenna metal layer, wherein the third antenna metal layer is aligned with the third antenna metal column which is aligned with the third antenna metal block.

12. The fan-out antenna packaging structure according to claim 10, wherein the first, second and third fan-out antenna packaging structures each has a warpage level ranging from 0.1 mm to 3.0 mm.

13. The fan-out antenna packaging structure according to claim 10, wherein the first, second and third antenna structure has a thickness ranging from 50 μ

m to 1000 μ

m.

14. The fan-out antenna packaging structure according to claim 10, wherein the first antenna packaging layer surrounds the first antenna metal connecting column and exposes a top surface of the first antenna metal connecting column, and the first antenna metal layer is located on a top surface of the first antenna packaging layer and is electrically connected to the first metal connecting column.

15. The fan-out antenna packaging structure according to claim 10, wherein the first, second and third packaging layers each comprises an epoxy molding layer.

16. The fan-out antenna packaging structure according to claim 10, wherein the metal bump protrudes from the through hole.