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SEMICONDUCTOR PACKAGE

  • US 20200135683A1
  • Filed: 07/15/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/24/2018
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a first semiconductor chip including a body portion, a first bonding layer disposed on a first surface of the body portion, and through vias passing through at least a portion of the body portion; and

    a first redistribution portion disposed in a lower portion of the first semiconductor chip to be connected to the first semiconductor chip through the first bonding layer, the first redistribution portion including first redistribution layers electrically connected to the first semiconductor chip, at least one first wiring insulating layer disposed between the first redistribution layers, and a second bonding layer connected to the first bonding layer,wherein the first bonding layer and the second bonding layer include first metal pads and second metal pads disposed to correspond to each other and bonded to each other, respectively, and a first insulating layer and a second bonding insulating layer surrounding the first metal pads and the second metal pads, respectively.

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