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SEMICONDUCTOR PACKAGE

  • US 20200135684A1
  • Filed: 07/19/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/24/2018
  • Status: Abandoned Application
First Claim
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1. A semiconductor package, comprising:

  • a first semiconductor chip including a first bonding layer on a surface; and

    a chip structure stacked on the first semiconductor chip and including a second bonding layer on a surface facing the first semiconductor chip and a plurality of second semiconductor chips, wherein;

    the plurality of second semiconductor chips include a chip area and a scribe area outside of the chip area, respectively, the plurality of second semiconductor chips being connected to each other by the scribe area in the chip structure, andthe first and second bonding layers include first and second metal pads disposed to correspond to each other and bonded to each other, respectively, and first and second bonding insulating layers surrounding the first and second metal pads, respectively.

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