METHOD FOR DETERMINING BONDING PAD SPACING ON THE SURFACE OF BONDING WIRE CHIP

• US 20200135685A1
• Filed: 09/30/2017
• Published: 04/30/2020
• Est. Priority Date: 06/06/2017
• Status: Abandoned Application

• Current Assignee: Lansus Technologies Inc.
• Original Assignee: Lansus Technologies Inc.
• Inventors: WU, Xianwei, LONG, Hua, ZHENG, Rui
• Application Number:
  US16/619,578
• Publication Number:
  US 20200135685A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/037 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0612 Layout
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/43 Manufacturing methods
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/381 Pitch distance

Abstract

A method for determining a bonding pad spacing on the surface of a bonding wire chip includes the steps of setting a loop height (“K”); selecting a capillary, measuring an expansion angle of a capillary sharp mouth (“C”); measuring the diameter of the capillary sharp mouth (“T”); measuring the hole diameter of the capillary (“H”); and determining a bonding pad spacing on the surface of a bonding wire chip (“P”). The formula is as follows: P=(T+H)/2+[tan(C/2)]*K. This method more accurately determines bonding pad spacing on the surface of a bonding wire chip, thereby providing a wider performance adjustment space. Additionally, problems, such as mutual inductance abnormalities caused by wire deformation or even by short circuits with other circuits due to the contact between a packaged capillary and a bonded wire can be lowered, thereby improving the working efficiency and reducing the number of times verification is performed.

Claims

1. A method for determining a bonding pad spacing on a surface of a bonding wire chip, comprising:

setting a loop height, and defining the loop height as K;

selecting a capillary, measuring an expansion angle of a capillary sharp mouth, and defining the expansion angle as C;

measuring a diameter of the capillary sharp mouth, and defining the diameter as T;

measuring a hole diameter of the capillary, and defining the hole diameter as H; and

determining a bonding pad spacing on a surface of a bonding wire chip, and defining the spacing as P according to a formula as follow;

P=(T+H)/2+[tan(C/2)]*K.

2. The method according to claim 1, further comprising:

carrying out rounding processing on the bonding pad spacing obtained with the formula.

3. The method according to claim 1, wherein the expansion angle C of the capillary sharp mouth of the selected capillary is 30°

when a wire diameter is 25 μ

m.

4. The method according to claim 1, wherein the diameter T of the capillary sharp mouth of the selected capillary is 80 μ

m-100 μ

m when a wire diameter is 25 μ

m.

5. The method according to claim 1, wherein the hole diameter H of the capillary is set to be greater than a wire diameter.

6. The method according to claim 5, wherein the hole diameter H of the capillary is set to be greater than the wire diameter by 3 μ

m-8 μ

m.