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METHOD FOR DETERMINING BONDING PAD SPACING ON THE SURFACE OF BONDING WIRE CHIP

  • US 20200135685A1
  • Filed: 09/30/2017
  • Published: 04/30/2020
  • Est. Priority Date: 06/06/2017
  • Status: Abandoned Application
First Claim
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1. A method for determining a bonding pad spacing on a surface of a bonding wire chip, comprising:

  • setting a loop height, and defining the loop height as K;

    selecting a capillary, measuring an expansion angle of a capillary sharp mouth, and defining the expansion angle as C;

    measuring a diameter of the capillary sharp mouth, and defining the diameter as T;

    measuring a hole diameter of the capillary, and defining the hole diameter as H; and

    determining a bonding pad spacing on a surface of a bonding wire chip, and defining the spacing as P according to a formula as follow;


    P=(T+H)/2+[tan(C/2)]*K.

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