APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

• US 20200135688A1
• Filed: 12/23/2019
• Published: 04/30/2020
• Est. Priority Date: 02/07/2017
• Status: Active Grant

• Current Assignee: Rohinni LLC
• Original Assignee: Rohinni LLC
• Inventors: Huska, Andrew, Peterson, Cody
• Granted Patent: US 11,183,478 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/75262 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75263 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/753 by means of pressure
• CPC Class Codes: H01L 2224/75301 Bonding head
• CPC Class Codes: H01L 2224/75343 by ultrasonic vibrations
• CPC Class Codes: H01L 2224/75701 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75702 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75704 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75705 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75753 Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/75901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 2224/79262 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/7955 Mechanical means, e.g. for pressing, stamping
• CPC Class Codes: H01L 2224/79753 : Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/81005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/81121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/8122 : with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/81862 : Heat curing
• CPC Class Codes: H01L 2224/81905 : Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904
• CPC Class Codes: H01L 2224/83005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83193 : wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83201 : Compression bonding
• CPC Class Codes: H01L 2224/83203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83224 : using a laser
• CPC Class Codes: H01L 2224/83805 : involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/86121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/86214 : using a laser
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/79 : Apparatus for Tape Automated Bonding [TAB]
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/86 : using tape automated bonding [TAB]
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 33/0095 : Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of directly transferring a first semiconductor device die to a substrate includes loading a wafer tape into a first frame, loading a substrate into a second frame, arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to a first side of the wafer tape, and orienting a needle to a position adjacent to a second side of the wafer tape, the needle extending in a direction toward the wafer tape. The method also includes activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

Claims

1. A method of directly transferring a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the method comprising:

loading the wafer tape into a first frame;

loading the substrate into a second frame;

arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape;

orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape;

activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die; and

inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

2. The method of claim 1, further comprising loading transfer process data into a controller communicatively coupled with the first frame, the second frame, and the needle actuator,

wherein the controller is configured to control the arranging, the orienting, and the activating, based at least in part on the transfer process data.

3. The method of claim 2, further comprising determining a position of the first semiconductor device die relative to a die transfer location on the second semiconductor device die to provide the controller with alignment information.

4. The method of claim 1, wherein the activating moves the needle to press on the second side of the wafer tape to cause a deflection of the wafer tape localized at the first semiconductor device die.

5. The method of claim 1, wherein inducing the bond is executed via an energy-emitting device.

6. The method of claim 1, further comprising determining whether additional semiconductor device dies are to be transferred from the wafer tape to the substrate,

wherein, when determined that additional semiconductor device dies are to be transferred, the method further comprises arranging the first frame and the second frame to a subsequent die transfer orientation.

7. The method of claim 1, wherein the arranging includes:

determining, based at least in part on data input from a first optical sensor, a position of the first semiconductor device die with respect to a die transfer location on the second semiconductor device die; and

determining, based at least in part on a data input from a second optical sensor, a position of the die transfer location on the second semiconductor device die.

8. The method of claim 1, wherein the activating includes moving the needle to cause a deflection of the wafer tape localized at a position of the first semiconductor device die.

9. A method of directly transferring semiconductor device die, comprising:

loading a wafer tape into a first frame, the wafer tape having a first side and a second side;

loading a substrate into a second frame, the substrate including a second semiconductor device die onto which a first semiconductor device die is to be transferred;

arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape;

orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape;

activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

10. The method of claim 9, further comprising:

loading transfer process data into a controller communicatively coupled with the first frame, the second frame, and the needle actuator,

wherein the controller is configured to control the arranging, the orienting, and the activating, based at least in part on the transfer process data.

11. The method of claim 10, further comprising determining a position of the first semiconductor device die relative to a die transfer location on the second semiconductor device die to provide the controller with alignment information.

12. The method of claim 9, wherein the arranging includes determining, based at least in part on data input from a first optical sensor, a position of the first semiconductor device die with respect to a die transfer location on the second semiconductor device die.

13. The method of claim 12, wherein the arranging further includes determining, based at least in part on a data input from a second optical sensor, a position of the die transfer location on the second semiconductor device die.

14. The method of claim 9, further comprising inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

15. The method of claim 14, wherein the inducing of the bond between the first semiconductor device die and the second semiconductor device die includes applying a vibratory pressure.

16. The method of claim 9, wherein the activating moves the needle to press on the second side of the wafer tape to cause a deflection of the wafer tape localized at the first semiconductor device die.

17. The method of claim 9, further comprising:

determining whether additional semiconductor device dies are to be transferred from the wafer tape to the substrate,

in response to a determination that the additional semiconductor device dies are to be transferred from the wafer tape to the substrate, arranging the first frame and the second frame to a subsequent die transfer orientation.