APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
First Claim
1. A method of directly transferring a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the method comprising:
- loading the wafer tape into a first frame;
loading the substrate into a second frame;
arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape;
orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape;
activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die; and
inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.
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Accused Products
Abstract
A method of directly transferring a first semiconductor device die to a substrate includes loading a wafer tape into a first frame, loading a substrate into a second frame, arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to a first side of the wafer tape, and orienting a needle to a position adjacent to a second side of the wafer tape, the needle extending in a direction toward the wafer tape. The method also includes activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.
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Citations
17 Claims
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1. A method of directly transferring a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the method comprising:
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loading the wafer tape into a first frame; loading the substrate into a second frame; arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape; orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape; activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die; and inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of directly transferring semiconductor device die, comprising:
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loading a wafer tape into a first frame, the wafer tape having a first side and a second side; loading a substrate into a second frame, the substrate including a second semiconductor device die onto which a first semiconductor device die is to be transferred; arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape; orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape; activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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Specification