METHODS FOR BONDING SUBSTRATES
First Claim
1. A method for bonding substrates, comprising:
- performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate;
performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate;
positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate; and
bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate.
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Accused Products
Abstract
Methods for bonding substrates used, for example, in substrate-level packaging, are provided herein. In some embodiments, a method for bonding substrates includes: performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate, performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate, positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate, and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate.
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Citations
20 Claims
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1. A method for bonding substrates, comprising:
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performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate; performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate; positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate; and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A nontransitory computer readable storage medium having stored thereon instructions that when executed by a processor perform a method for bonding substrates, the method comprising:
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performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate; performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate; positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate; and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate. - View Dependent Claims (16, 17, 18)
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19. A method for bonding substrates, comprising:
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performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate and form a bonding interface on each of the first substrate and the second substrate; positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate; and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate. - View Dependent Claims (20)
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Specification