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CHIP ON FILM PACKAGE

  • US 20200135695A1
  • Filed: 10/29/2018
  • Published: 04/30/2020
  • Est. Priority Date: 10/29/2018
  • Status: Active Grant
First Claim
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1. A chip on film package, comprising:

  • a flexible film comprising a first surface and a second surface opposite to the first surface;

    a first patterned circuit layer disposed on the first surface;

    one or more first chips mounted on the first surface and electrically connected to the first patterned circuit layer;

    a second patterned circuit layer disposed on the second surface; and

    one or more second chips mounted on the second surface and electrically connected to the second patterned circuit layer.

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