ENHANCED CHANNEL STRAIN TO REDUCE CONTACT RESISTANCE IN NMOS FET DEVICES
First Claim
1. A fin field-effect transistor (Fin FET) semiconductor device, comprising:
- a substrate;
a first fin structure having a channel region;
a second fin structure having a channel region;
a first epitaxial layer including a first strained material that provides stress to the channel region of the first fin structure; and
a second epitaxial layer including a second strained material that provides stress to the channel region of the second fin structure,wherein the second epitaxial layer has a first region and a second region, the first region being located closer to a surface of the second epitaxial layer than the second region,wherein the first region has a first doping concentration of a first dopant and the second region has a second doping concentration of a second dopant,wherein the first doping concentration is greater than the second doping concentration, andwherein a thickness of the first region from a surface of the second epitaxial layer to the second region ranges from 0.1 nm to 8 nm.
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Accused Products
Abstract
A semiconductor device includes a substrate, a fin structure and an isolation layer formed on the substrate and adjacent to the fin structure. The semiconductor device includes a gate structure formed on at least a portion of the fin structure and the isolation layer. The semiconductor device includes an epitaxial layer including a strained material that provides stress to a channel region of the fin structure. The epitaxial layer has a first region and a second region, in which the first region has a first doping concentration of a first doping agent and the second region has a second doping concentration of a second doping agent. The first doping concentration is greater than the second doping concentration. The epitaxial layer is doped by ion implantation using phosphorous dimer.
5 Citations
20 Claims
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1. A fin field-effect transistor (Fin FET) semiconductor device, comprising:
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a substrate; a first fin structure having a channel region; a second fin structure having a channel region; a first epitaxial layer including a first strained material that provides stress to the channel region of the first fin structure; and a second epitaxial layer including a second strained material that provides stress to the channel region of the second fin structure, wherein the second epitaxial layer has a first region and a second region, the first region being located closer to a surface of the second epitaxial layer than the second region, wherein the first region has a first doping concentration of a first dopant and the second region has a second doping concentration of a second dopant, wherein the first doping concentration is greater than the second doping concentration, and wherein a thickness of the first region from a surface of the second epitaxial layer to the second region ranges from 0.1 nm to 8 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A fin field-effect transistor (Fin FET) semiconductor device, comprising:
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a substrate; a first fin having a channel region; a second fin having a channel region; a first gate electrode disposed over a first portion of the first fin; a second gate electrode disposed over a first portion of the second fin; a first epitaxial layer disposed over the first fin on opposing sides of the channel region of the first fin; and a second epitaxial layer disposed over the first fin on opposing sides of the channel region of the second fin, wherein the second epitaxial layer has a first region and a second region, the first region being located closer to a surface of the second epitaxial layer than the second region, wherein a first dopant in the first region has a first lateral variance and a second dopant in the second region has a second lateral variance, wherein the first lateral variance is greater than the second lateral variance, and wherein a thickness of the first region from a surface of the second epitaxial layer to the second region ranges from 0.1 nm to 8 nm. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A fin field-effect transistor (Fin FET) semiconductor device, comprising:
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a substrate; a first fin having a channel region; a second fin having a channel region; a first gate electrode disposed over a first portion of the first fin; a second gate electrode disposed over a first portion of the second fin; a first epitaxial layer disposed over the first fin on opposing sides of the channel region of the first fin; and a second epitaxial layer disposed over the second fin on opposing sides of the channel region of the second fin, wherein the second epitaxial layer has a first region and a second region, the first region being located closer to a surface of the second epitaxial layer than the second region, wherein the first region has a first doping concentration of a first dopant and the second region has a second doping concentration of a second dopant, wherein the first doping concentration of the first dopant is greater than the second doping concentration of the second dopant, and wherein the channel region of the second fin has a higher channel mobility than the channel region of the first fin. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification