METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
First Claim
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1. A method of manufacturing a semiconductor device, comprising:
- forming a stack;
forming a first slit penetrating from a top surface of the stack into the stack to a first depth, and a second slit penetrating from the top surface of the stack into the stack to a second depth;
removing sacrificial layers of the stack through the first slit and the second slit that have different depths; and
filling areas from which the sacrificial layers have been removed with line patterns separated from each other by the first slit and the second slit.
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Abstract
Provided herein may be a method of manufacturing a semiconductor device including the step of replacing sacrificial layers of a stack with line patterns through slits that pass through the stack and have different depths.
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Citations
15 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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forming a stack; forming a first slit penetrating from a top surface of the stack into the stack to a first depth, and a second slit penetrating from the top surface of the stack into the stack to a second depth; removing sacrificial layers of the stack through the first slit and the second slit that have different depths; and filling areas from which the sacrificial layers have been removed with line patterns separated from each other by the first slit and the second slit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor device, comprising:
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forming a first stack; forming a second stack over the first stack; forming slits passing through at least one of the first stack and the second stack such that a number of slits passing through the second stack is greater than a number of slits passing through the first stack; removing first sacrificial layers of the first stack and second sacrificial layers of the second stack through the slits; and filling areas from which the first sacrificial layers and the second sacrificial layers have been removed with line patterns through the slits. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification