LENS MODULE

• US 20200135778A1
• Filed: 12/17/2018
• Published: 04/30/2020
• Est. Priority Date: 10/29/2018
• Status: Active Grant

• Current Assignee: Triple Win Technology Company Limited
• Original Assignee: Triple Win Technology Company Limited
• Inventors: LI, YU-SHUAI, CHEN, SHIN-WEN, LI, KUN, FAN, KE-HUA
• Granted Patent: US 10,748,946 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 25/00 Circuitry of solid-state image sensors [SSIS]; Control thereof
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42

Abstract

A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.

Claims

1. A lens module comprising:

a circuit board;

a mounting bracket which is hollow;

a photosensitive chip mounted within the mounting bracket on a surface of the circuit board;

a lens base mounted on a surface of the mounting bracket opposite to the circuit board, the lens base axially defining a through hole; and

a lens mounted within the lens base;

wherein;

the lens base comprises screw thread formed along an inner wall of the through hole;

the lens comprises mating threads formed along a periphery of the lens contacting the inner wall of the through hole;

the mating threads define at least one thread slot, a gap being defined between the screw threads on the inner wall of the through hole and the at least one thread slot.

2. The lens module of claim 1, further comprising a light filter, wherein:

the mounting bracket defines an accommodating space;

a flange protrudes within the accommodating space and surrounds an axis of the accommodating space;

the light filter is mounted on the flange within the accommodating space;

the flange defines at least one flange slot, a gap is defined between the light filter and the at least one flange slot when the light filter is mounted on the flange.

3. The lens module of claim 2, wherein:

the accommodating space is stepped hole comprising a first recessed area and a second recessed area;

the second recessed area is recessed within the first recessed area;

the flange is formed within the second recessed area;

the photosensitive chip is received within the first recessed area; and

the light filter is mounted on the flange and received within the second recessed area.

4. The lens module of claim 2, wherein the light filter is an IR-cut filter.

5. The lens module of claim 2, wherein:

the at least one thread slot extends along an axial direction of the lens; and

the at least one thread slot and the at least one flange slot are crisscrossed.

6. The lens module of claim 1, wherein:

the circuit board is a flexible-hard composite board comprising a first hard portion, a second hard portion, and a flexible portion;

the flexible portion is coupled between the first hard portion and the second hard portion; and

the photosensitive chip is mounted to the first hard portion.

7. The lens module of claim 6, wherein:

the photosensitive chip comprises a metal lead surrounding a periphery of a surface of the photosensitive chip;

the metal lead is electrically coupled to a plurality of gold fingers of the first hard portion; and

the second hard portion comprises an electric coupling component.

8. The lens module of claim 1, wherein the photosensitive chip is a complementary metal oxide semiconductor chip.

9. The lens module of claim 1, wherein the lens base is a voice coil motor or a bracket.

10. The lens module of claim 1, wherein the lens is made of resin.

11. The lens module of claim 1 further comprising a first adhesive layer mounting the photosensitive chip to the circuit board.