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HIGH PERFORMANCE IMAGE SENSOR

  • US 20200135792A1
  • Filed: 03/13/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/29/2018
  • Status: Active Grant
First Claim
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1. An integrated chip, comprising:

  • an image sensing element disposed within a pixel region of a substrate;

    a plurality of conductive interconnect layers disposed within a dielectric structure arranged along a first side of the substrate; and

    wherein a second side of the substrate comprises a plurality of interior surfaces arranged directly over the image sensing element, the plurality of interior surfaces respectively comprising a substantially flat surface that extends along a plane.

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