PHOTOELECTRIC CONVERTING DEVICE AND APPARATUS

• US 20200135793A1
• Filed: 10/22/2019
• Published: 04/30/2020
• Est. Priority Date: 10/29/2018
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Torii, Keita, Ina, Hideki
• Granted Patent: US 11,682,688 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/08145 the bodies being stacked
• CPC Class Codes: H01L 27/14605 Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration

Abstract

A photoelectric converting device including: a semiconductor layer with a front surface and a back surface, the semiconductor layer including a photoelectric conversion portion; a wire structure including an insulating film, the wire structure being disposed on the front surface of the semiconductor layer; a first insulator portion disposed in a trench provided in the semiconductor layer; and a second insulator portion disposed between the first insulator portion and the insulating film, wherein the first insulator portion has a maximum width larger than a maximum width of the second insulator portion.

Claims

1. A photoelectric converting device comprising:

a semiconductor layer with a front surface and a back surface, the semiconductor layer including a photoelectric conversion portion;

a wire structure including an insulating film, the wire structure being disposed on the front surface of the semiconductor layer;

a first insulator portion disposed in a trench provided in the semiconductor layer; and

a second insulator portion disposed between the first insulator portion and the insulating film,

wherein the first insulator portion has a maximum width larger than a maximum width of the second insulator portion.

2. The photoelectric converting device according to claim 1, wherein the maximum width of the first insulator portion is equal to or greater than a sum of a width of the second insulator portion and a double of an alignment error during formation of the second insulator portion.

3. The photoelectric converting device according to claim 1, wherein the first insulator portion has a portion connected to the second insulator portion and the portion has a width smaller than a width of the second insulator portion.

4. The photoelectric converting device according to claim 1, wherein

in a top perspective view in a direction perpendicular to the front side of the semiconductor layer, the second insulator portion is located in the first insulator portion.

5. The photoelectric converting device according to claim 1, wherein the first insulator portion increases in width toward the back surface side from the front surface side.

6. The photoelectric converting device according to claim 1, wherein the first insulator portion has the maximum width at an intermediate portion.

7. The photoelectric converting device according to claim 1, wherein the first insulator portion is a wafer alignment mark.

8. The photoelectric converting device according to claim 1,

wherein the semiconductor layer is stacked on the wire structure including an electrode pad and has an opening from which the electrode pad is exposed, and

wherein the first insulator portion and the second insulator portion are disposed around the opening.

9. The photoelectric converting device according to claim 1, wherein the first insulator portion is an overlay test mark.

10. An apparatus comprising:

the photoelectric converting device according to claim 1; and

at least one of;

an optical system configured to form an image on the photoelectric converting device;

a controller configured to control the photoelectric converting device;

a processor configured to process a signal outputted from the photoelectric converting device;

a display device configured to display information obtained in the photoelectric converting device;

a storage device configured to store information obtained in the photoelectric converting device; and

a machine configured to operate on the basis of information obtained in the photoelectric converting device.