Semiconductor Device With Magnetic Tunnel Junctions
First Claim
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1. A semiconductor device comprising:
- a substrate;
a memory array over the substrate, the memory array comprising first magnetic tunnel junctions (MTJs), wherein the first MTJs are in a first dielectric layer over the substrate; and
a resistor circuit over the substrate, the resistor circuit comprising second MTJs, wherein the second MTJs are in the first dielectric layer.
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Abstract
A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.
3 Citations
20 Claims
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1. A semiconductor device comprising:
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a substrate; a memory array over the substrate, the memory array comprising first magnetic tunnel junctions (MTJs), wherein the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit comprising second MTJs, wherein the second MTJs are in the first dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor device comprising:
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a memory array in a memory region of the semiconductor device and comprising first magnetic tunnel junctions (MTJs), wherein the first MTJs are configured to store data bits; and a resistor circuit in a logic region of the semiconductor device and comprising second MTJs that are electrically coupled together to provide an equivalent electrical resistance, wherein the first MTJs and the second MTJs are disposed in a same dielectric layer over a substrate of the semiconductor device. - View Dependent Claims (14, 15, 16, 17)
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18. A method of forming a semiconductor device, the method comprising:
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forming a memory array over a substrate, wherein forming the memory array comprises forming first magnetic tunnel junctions (MTJs) in a first dielectric layer over the substrate; and forming a resistor circuit over the substrate, wherein forming the resistor circuit comprises forming second MTJs in the first dielectric layer and electrically coupling the second MTJs to provide an electrical resistance. - View Dependent Claims (19, 20)
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Specification