MULTI-GATE DEVICE AND METHOD OF FABRICATION THEREOF
First Claim
1. A method of forming a semiconductor device, the method comprising:
- providing a fin having a channel region, wherein the fin includes first, second, and third layers;
removing at least a portion of the second layer from the channel region to form a gap between the first and third layers;
forming an interposing feature in the channel region at least partially wrapping around the first layer and the third layer;
forming a metal layer along opposing sidewalls of the interposing feature for performing a scavenging process to the interposing feature,wherein a distance between the first layer and third layer is determined based on a predetermined scavenging threshold of the scavenging process.
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Abstract
A semiconductor device includes a fin extending from a substrate. The fin has a source/drain region and a channel region. The channel region includes a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer and vertically separated from the first semiconductor layer by a spacing area. A high-k dielectric layer at least partially wraps around the first semiconductor layer and the second semiconductor layer. A metal layer is formed along opposing sidewalls of the high-k dielectric layer. The metal layer includes a first material. The spacing area is free of the first material.
6 Citations
20 Claims
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1. A method of forming a semiconductor device, the method comprising:
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providing a fin having a channel region, wherein the fin includes first, second, and third layers; removing at least a portion of the second layer from the channel region to form a gap between the first and third layers; forming an interposing feature in the channel region at least partially wrapping around the first layer and the third layer; forming a metal layer along opposing sidewalls of the interposing feature for performing a scavenging process to the interposing feature, wherein a distance between the first layer and third layer is determined based on a predetermined scavenging threshold of the scavenging process. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method, comprising:
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forming a fin element including first, second, and third semiconductor layers; removing at least a portion of the second semiconductor layer from a channel region of the fin element to form a gap between the first and third semiconductor layers; forming an interposing feature in the channel region, wherein the interposing feature includes; a dielectric layer at least partially wrapping around the first semiconductor layer and the third semiconductor layer; depositing a metal layer at least partially wrapping around the interposing feature for performing a scavenging process to the interposing feature. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method, comprising:
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providing a substrate including a fin element, the fin element including a bottom layer disposed over the substrate, a middle layer disposed over the bottom layer, and a top layer disposed over the middle layer; forming a dummy gate structure in a channel region of the fin element; forming a source/drain feature in a source/drain region of the fin element adjacent to the dummy gate structure; removing the dummy gate structure to form an opening in the channel region to expose the fin element in the channel region; removing at least a portion of the middle layer of the fin element exposed in the opening; forming an interposing feature in the channel region, wherein the interposing feature at least partially wrapping around the bottom layer and the top layer; forming a metal layer along opposing sidewalls of the interposing feature in the channel region; and causing a scavenging process to the interposing feature by performing an annealing process to the metal layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification