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METHOD OF PREVENTING CONTAMINATION OF LED DIE

  • US 20200135963A1
  • Filed: 12/27/2019
  • Published: 04/30/2020
  • Est. Priority Date: 12/14/2017
  • Status: Active Grant
First Claim
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1. A method comprising:

  • (a) providing a wafer comprising an epitaxy layer and a dielectric layer with openings having metal contacts;

    (b) depositing a barrier layer on the metal contacts and the dielectric layer;

    (c) depositing a patterned photoresistive layer on the barrier layer in regions of the wafer overlaying the metal contact;

    (d) depositing a reflective layer on the patterned photoresistive layer and the barrier layer; and

    (e) removing the patterned photoresistive layer including portions of the reflective layer overlaying the patterned photoresistive layer.

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