METHOD AND MANUFACTURING SYSTEM FOR PRODUCING MICROELECTRONIC COMPONENTS WITH A LAYER STRUCTURE

• US 20200135965A1
• Filed: 03/21/2018
• Published: 04/30/2020
• Est. Priority Date: 04/03/2017
• Status: Active Grant

• Current Assignee: 3D- Micromac AG
• Original Assignee: 3D- Micromac AG
• Inventors: Albert, Sven, Boettcher, Rene, Boehm, Alexander, Lindner, Mike, Schmidt, Thomas
• Granted Patent: US 11,245,052 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 43/006 Delaminating
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/7806 involving the separation of the active layers from a substrate
• CPC Class Codes: H01L 21/7813 leaving a reusable substrate, e.g. epitaxial lift off
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate

Abstract

A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.

Claims

1-15. -15. (canceled)

16. A method of producing microelectronic components comprising a carrier and a microelectronic functional layer system applied to the carrier, the method comprising:

forming a functional layer system on a front side of a growth substrate;

applying a laminar carrier to the functional layer system for constitution of a workpiece in the form of a layered composite comprised of the carrier, the functional layer system and the growth substrate;

attaching the workpiece to a workpiece carrier such that a reverse side of the growth substrate arranged opposite a front side is accessible;

utilizing incident radiation of a laser beam from the reverse side of the growth substrate through said growth substrate such that the laser beam is focused in a boundary region between the growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed;

separating a functional layer stack comprised of the carrier and the functional layer system from the growth substrate,

wherein

for separation of the functional layer stack from the growth substrate, a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate,

further to the applying. a negative pressure is generated in the inner region such that, by introduction of a separating force to the growth substrate. separation of the functional layer stack from the growth substrate is initiated in the inner region; and

the growth substrate held on the vacuum gripper is removed from the functional layer stack that is held on the workpiece carrier.

17. The method as claimed in claim 16, wherein the workpiece carrier is configured as a vacuum tensioning device having a sealing zone that circumferentially encloses an inner region, and the workpiece is applied to the workpiece carrier such that contact with the workpiece carrier is only established in the region of the sealing zone and a negative pressure is then generated in the inner region.

18. The method as claimed in claim 16, further comprising measuring a surface profile of the workpiece held by the workpiece carrier prior to irradiation and/or during irradiation by the laser beam to record shape data, and by focus control of the laser beam during irradiation in accordance with the shape data, wherein the measuring is executed by a contactless method or a white light interferometry or laser triangulation.

19. The method as claimed in claim 16, wherein, prior to irradiation by the laser beam, a fluid layer comprising a fluid transparent to laser radiation is brought into contact with the reverse side of the growth substrate, and in that irradiation by the laser beam is executed through the fluid layer, and the fluid layer is applied to the reverse side of the growth substrate by spin coating or spraying.

20. The method as claimed in claim 16, wherein an incident laser beam with a line profile is employed, and a transverse relative movement is executed between the laser beam and the workpiece, perpendicularly to a longitudinal axis of the line profile.

21. The method as claimed in claim 16, wherein the incident laser beam is oriented obliquely to the reverse side of the growth substrate, wherein, optionally, an angle between a surface normal of the reverse side and the direction of incidence is 5°

to 10°

.

22. The method as claimed in claim 16, wherein the workpiece secured to the workpiece carrier is heated to a temperature exceeding ambient temperature, and the temperature is at least 50°

C. and/or is limited to a maximum of 150°

C.

23. The method as claimed in claim 22, wherein the workpiece is heated by a heating device integrated in the workpiece carrier, and heat-up is executed in a contactless arrangement by thermal radiation and/or convection.

24. A manufacturing system that produces microelectronic components that comprise a carrier and a microelectronic functional layer system applied to the carrier, the system comprising:

a workpiece carrier that accommodates a workpiece in the form of a layered composite comprising a carrier, a functional layer system bonded to the carrier, and a growth substrate bonded to the functional layer system;

a laser treatment station for incident radiation of a laser beam from a reverse side of the growth substrate through said growth substrate such that the laser beam is focused in a boundary region between the growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system is weakened or destroyed in the boundary region;

a debonding station that separates a functional layer stack comprising the carrier and the functional layer system from the growth substrate,

wherein

the debonding station comprises a vacuum gripper having a sealing zone that circumferentially encloses an inner region, that can be applied to a reverse side of the growth substrate such that an inner region can be sealed from the exterior by the sealing zone and, in the inner region, a clearance is provided between the vacuum gripper and the workpiece, and

devices that generate a negative pressure in the inner region are provided in the vacuum gripper which is applied to the workpiece.

25. The manufacturing system as claimed in claim 24, wherein the vacuum gripper comprises a pot-shaped main body with a closed circumferential raised edge, and a circumferential seal of rubber or silicone is arranged on an end face of said edge.

26. The manufacturing system as claimed in claim 24, wherein the workpiece carrier is configured as a vacuum tensioning device having a sealing zone that circumferentially encloses an inner region, and the workpiece can be applied to the workpiece carrier such that contact with said workpiece carrier is only established in the region of the sealing zone and a negative pressure can be generated in the inner region.

27. The manufacturing system as claimed in claim 24, wherein the workpiece carrier comprises a pot-shaped main body, incorporating a recess enclosed by a raised edge.

28. The manufacturing system as claimed in claim 24, wherein the workpiece carrier incorporates an integrated heating device for the heat-up of the workpiece carried by the workpiece carrier.

29. The manufacturing system as claimed in claim 28, wherein the heating device comprises an electrically-heatable and metallic body having an open pore structure and/or fluid ducts, and said body is inserted in a recess of a pot-shaped main body of the workpiece carrier.

30. The manufacturing system as claimed in claim 24, wherein said system is configured for execution of a method of producing microelectronic components comprising a carrier and a microelectronic functional layer system applied to the carrier, the method comprising:

forming a functional layer system on a front side of a growth substrate;

applying a laminar carrier to the functional layer system for constitution of a workpiece in the form of a layered composite comprised of the carrier, the functional layer system and the growth substrate;

attaching the workpiece to a workpiece carrier such that a reverse side of the growth substrate arranged opposite a front side is accessible;

utilizing incident radiation of a laser beam from the reverse side of the growth substrate through said growth substrate such that the laser beam is focused in a boundary region between the growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed;

separating a functional layer stack comprised of the carrier and the functional layer system from the growth substrate,

wherein

for separation of the functional layer stack from the growth substrate, a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate,

further to the applying, a negative pressure is generated in the inner region such that, by introduction of a separating force to the growth substrate, separation of the functional layer stack from the growth substrate is initiated in the inner region; and

the growth substrate held on the vacuum gripper is removed from the functional layer stack that is held on the workpiece carrier.